Display panel, and light-emitting elements and backplate for display panel
AssigneeXiamen Extremely PQ Display Technology Co., Ltd.
InventorGang Ma
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Abstract
A display panel, and light-emitting elements and a backplate used for display panels are provided. The backplate is provided thereon a first pad and a second pad serving as a repair pad. The first pad includes a first adhesive layer and a first bonding layer. The second pad includes a second adhesive layer and a second bonding layer. Each of the first and second bonding layers is a multi-layer structure including multiple single-metal layers. A bonding temperature of the first bonding layer is higher than that of the second bonding layer.
Claims19
A backplate, wherein a surface of the backplate is disposed with a first pad and a second pad configured to bond light-emitting elements, the second pad is configured as a repair pad, the first pad comprises a first adhesive layer and a first bonding layer, the second pad comprises a second adhesive layer and a second bonding layer, each of the first bonding layer and the second bonding layer is a multi-layer structure, the multiple-layer structure comprises a plurality of single-metal layers, and a bonding temperature of the first bonding layer is higher than a bonding temperature of the second bonding layer;
- wherein the first pad further comprises a first connection electrode arranged on a side of the first adhesive layer facing away from the first bonding layer and thereby the first connection electrode is located between the backplate and the first adhesive layer, an area of orthographic projection of the first adhesive layer on the surface of the backplate is 1.15-2.5 times of an area of orthographic projection of the first connection electrode on the surface of the backplate, and the area of orthographic projection of the first adhesive layer on the surface of the backplate is 1.15-2.5 times of an area of orthographic projection of the first bonding layer on the surface of the backplate;
- and/or
- wherein the second pad further comprises a second connection electrode arranged on a side of the second adhesive layer facing away from the second bonding layer and thereby the second connection electrode is located between the backplate and the second adhesive layer, an area of orthographic projection of the second adhesive layer on the surface of the backplate is 1.15-2.5 times of an area of orthographic projection of the second connection electrode on the surface of the backplate, and the area of orthographic projection of the second adhesive layer on the surface of the backplate is 1.15-2.5 times of an area of orthographic projection of the second bonding layer on the surface of the backplate.
A backplate, wherein a surface of the backplate is disposed with a first pad and a second pad configured to bond light-emitting elements, the second pad is configured as a repair pad, the first pad comprises a first adhesive layer and a first bonding layer, the second pad comprises a second adhesive layer and a second bonding layer, each of the first bonding layer and the second bonding layer is a multi-layer structure, the multiple-layer structure comprises a plurality of single-metal layers, the plurality of single-metal layers comprise at least two single-metal layers formed of different metals, the at least two single-metal layers comprise sequentially stacked single-metal layers formed of a first metal and a second metal, a melting point of the first metal is higher than that of the second metal, a thickness ratio of the single-metal layer formed of the first metal to the single-metal layer formed of the second metal in the first bonding layer is a first thickness ratio, a thickness ratio of the single-metal layer formed of the first metal to the single-metal layer formed of the second metal in the second bonding layer is a second thickness ratio, and the first thickness ratio is greater than the second thickness ratio thereby making a bonding temperature of the first bonding layer is higher than a bonding temperature of the second bonding layer;
- wherein the first pad further comprises a first connection electrode arranged on a side of the first adhesive layer facing away from the first bonding layer and thereby the first connection electrode is located between the backplate and the first adhesive layer, the first adhesive layer further extends onto two opposite side surfaces of the first connection electrode along a direction facing towards the backplate, and an area of orthographic projection of the first adhesive layer on the surface of the backplate is greater than an area of orthographic projection of the first connection electrode on the surface of the backplate.
A backplate, wherein a surface of the backplate is disposed with a first pad and a second pad configured to bond light-emitting elements, the second pad is configured as a repair pad, the first pad comprises a first adhesive layer and a first bonding layer, the second pad comprises a second adhesive layer and a second bonding layer, each of the first bonding layer and the second bonding layer is a multi-layer structure, the multiple-layer structure comprises a plurality of single-metal layers, the plurality of single-metal layers comprise at least two single-metal layers formed of different metals, the at least two single-metal layers comprise sequentially stacked single-metal layers formed of a first metal and a second metal, a melting point of the first metal is higher than that of the second metal, a thickness ratio of the single-metal layer formed of the first metal to the single-metal layer formed of the second metal in the first bonding layer is a first thickness ratio, a thickness ratio of the single-metal layer formed of the first metal to the single-metal layer formed of the second metal in the second bonding layer is a second thickness ratio, and the first thickness ratio is greater than the second thickness ratio thereby making a bonding temperature of the first bonding layer is higher than a bonding temperature of the second bonding layer;
- wherein the second pad further comprises a second connection electrode arranged on a side of the second adhesive layer facing away from the second bonding layer and thereby the second connection electrode is located between the backplate and the second adhesive layer, the second adhesive layer further extends onto two opposite side surfaces of the second connection electrode along a direction facing towards the backplate, and an area of orthographic projection of the second adhesive layer on the surface of the backplate is greater than an area of orthographic projection of the second connection electrode on the surface of the backplate.
Dependencies are inferred from the claim text.