H10F 39/199
Back-illuminated image sensors
Official title: {Back-illuminated image sensors}
H10F39/199 (Back-illuminated image sensors) appears on 4,245 US grants and 5,354 published applications in this corpus.
Search patents in H10F- Granted patents
- 4,245
- Published applications
- 5,354
- Assignees
- 411
- Inventors
- 3,911
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 6 |
| 2002 | 5 | 8 |
| 2003 | 4 | 10 |
| 2004 | 11 | 18 |
| 2005 | 7 | 21 |
| 2006 | 11 | 37 |
| 2007 | 18 | 39 |
| 2008 | 18 | 65 |
| 2009 | 34 | 93 |
| 2010 | 62 | 168 |
| 2011 | 88 | 174 |
| 2012 | 121 | 193 |
| 2013 | 169 | 251 |
| 2014 | 236 | 255 |
| 2015 | 272 | 336 |
| 2016 | 347 | 374 |
| 2017 | 334 | 314 |
| 2018 | 290 | 272 |
| 2019 | 307 | 356 |
| 2020 | 308 | 386 |
| 2021 | 283 | 418 |
| 2022 | 268 | 361 |
| 2023 | 282 | 375 |
| 2024 | 301 | 418 |
| 2025 | 266 | 283 |
| 2026 | 164 | 123 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low-power photonic demodulator6 Oct 2026US 12,757,502 B2The Hong Kong University of Science and Technology
- Image sensors including conductive pixel separation structures6 Oct 2026US RE51,061 E1Samsung Electronics Co., Ltd.
- Image sensors having high density subpixels therein with enhanced pixel separation structures29 Sep 2026US 12,751,103 B2Samsung Electronics Co., Ltd.
- Image sensor and electronic camera15 Sep 2026US 12,739,532 B2Nikon Corporation
- System and method for enhancing parasitic light sensitivity of image sensor15 Sep 2026US 12,739,536 B2Semiconductor Components Industries, LLC
- Image sensor device and methods of forming the same8 Oct 2026US 2026/0314103 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device crack-stop structure to prevent damage due to dicing crack8 Oct 2026US 2026/0314419 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor1 Oct 2026US 2026/0304970 A1Samsung Electronics Co., Ltd.
- High aspect ratio back side deep trench isolaton structure with substrate-embedded metal grid and no pinch off1 Oct 2026US 2026/0304971 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Solid-state imaging device and manufacturing method of the same1 Oct 2026US 2026/0304993 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Vertically stacked image sensor284US 8,773,562 B1Apple Inc. · 2014
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device252US 9,799,587 B2Sony Corporation · 2017
- Method and apparatus for image sensor packaging244US 9,337,235 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016