Solid-state imaging device and manufacturing method of the same
AssigneeSony Semiconductor Solutions Corporation
InventorShinichi YOSHIDA
Life of this patent
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Abstract
To provide a solid-state imaging device capable of suitably disposing a plug in a substrate, and a manufacturing method of the solid-state imaging device. A solid-state imaging device of the present disclosure includes a first substrate, a first transistor provided on the first substrate, a first insulating film provided on the first substrate and the first transistor, a first wiring provided in the first insulating film and electrically connected to the first substrate or the first transistor, a second substrate provided on the first insulating film, and a first plug provided in the first insulating film and the second substrate and provided on the first wiring to be electrically connected to the first wiring.
Claims20
A solid-state imaging device, comprising:
- a first substrate;
- a first transistor provided on the first substrate;
- a first insulating film provided on the first substrate and the first transistor;
- a first wiring provided in the first insulating film and electrically connected to the first substrate or the first transistor;
- a second substrate provided on the first insulating film;
- and
- a first plug provided in the first insulating film and the second substrate and provided on the first wiring to be electrically connected to the first wiring.
A manufacturing method of a solid-state imaging device, the manufacturing method comprising:
- forming a first transistor on a first substrate;
- forming a first portion of a first insulating film on the first substrate and the first transistor;
- forming a first wiring on the first portion of the first insulating film to be electrically connected to the first substrate or the first transistor;
- forming a second portion of the first insulating film on the first portion of the first insulating film and the first wiring;
- disposing a second substrate on the first insulating film;
- and
- forming a first plug provided on the first wiring and electrically connected to the first wiring in the first insulating film and the second substrate.
Dependencies are inferred from the claim text.