H10F 39/1575
Of the hybrid type
Official title: {of the hybrid type}
H10F39/1575 (Of the hybrid type) appears on 103 US grants and 15 published applications in this corpus.
Search patents in H10F- Granted patents
- 103
- Published applications
- 15
- Assignees
- 40
- Inventors
- 142
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 8 | 0 |
| 1987 | 11 | 0 |
| 1988 | 9 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 2 | 2 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 3 | 4 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Multilevel semiconductor device and structure with image sensors and wafer bonding19 Aug 2025US 12,396,284 B2Monolithic 3D Inc.
- Binning system11 Feb 2025US 12,225,312 B2Himax Imaging Limited
- Multilevel semiconductor device and structure with image sensors and wafer bonding3 Sep 2024US 12,080,743 B2Monolithic 3D Inc.
- Multilevel semiconductor device and structure with image sensors and wafer bonding12 Mar 2024US 11,929,372 B2Monolithic 3D Inc.
- Multilevel semiconductor device and structure with image sensors and wafer bonding9 Jan 2024US 11,869,915 B2Monolithic 3D Inc.
- Methods for fabricating a multilevel semiconductor device and structure with image sensors and wafer bonding13 Nov 2025US 2025/0351591 A1Monolithic 3D Inc.
- Multilevel semiconductor device and structure with image sensors and wafer bonding7 Nov 2024US 2024/0371906 A1Monolithic 3D Inc.
- Binning system26 Sep 2024US 2024/0323564 A1Himax Imaging Limited
- Multilevel semiconductor device and structure with image sensors and wafer bonding30 May 2024US 2024/0178257 A1Monolithic 3D Inc.
- Multilevel semiconductor device and structure with image sensors and wafer bonding8 Feb 2024US 2024/0047484 A1Monolithic 3D Inc.
Most cited
By later US patents
- Method of batch-fabricating flip-chip bonded dual integrated circuit arrays90US 4,416,054 AWestinghouse Electric Corp. · 1983
- Infrared detector and imaging system67US 4,670,653 ARockwell International Corporation · 1987
- Quantum well infared image conversion panel and associated methods58US 6,028,323 ANational Research Council of Canada · 2000
- Uncooled high resolution infrared imaging plane54US 4,754,139 AAerojet-General Corporation · 1988
- CCD focal plane processor for moving target imaging53US 4,064,533 AWestinghouse Electric Corp. · 1977