H10F 39/157
Ccd or cid infrared image sensors
Official title: {CCD or CID infrared image sensors}
H10F39/157 (Ccd or cid infrared image sensors) appears on 231 US grants and 55 published applications in this corpus.
Search patents in H10F- Granted patents
- 231
- Published applications
- 55
- Assignees
- 85
- Inventors
- 319
- Latest grant
- 16 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 8 | 0 |
| 1979 | 7 | 0 |
| 1980 | 13 | 0 |
| 1981 | 11 | 0 |
| 1982 | 8 | 0 |
| 1983 | 10 | 0 |
| 1984 | 6 | 0 |
| 1985 | 11 | 0 |
| 1986 | 14 | 0 |
| 1987 | 21 | 0 |
| 1988 | 13 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 8 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 2 |
| 2003 | 0 | 1 |
| 2004 | 2 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 1 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 2 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 2 | 1 |
| 2015 | 6 | 7 |
| 2016 | 2 | 3 |
| 2017 | 2 | 4 |
| 2018 | 2 | 5 |
| 2019 | 2 | 2 |
| 2020 | 2 | 3 |
| 2021 | 2 | 3 |
| 2022 | 5 | 3 |
| 2023 | 2 | 5 |
| 2024 | 6 | 5 |
| 2025 | 5 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Solid-state imaging device16 Sep 2025US 12,419,119 B2Tower Partners Semiconductor Co., Ltd.
- Multilevel semiconductor device and structure with image sensors and wafer bonding19 Aug 2025US 12,396,284 B2Monolithic 3D Inc.
- Optical sensor12 Aug 2025US 12,386,072 B2Robert Bosch GmbH
- Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the same17 Jun 2025US 12,334,333 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Binning system11 Feb 2025US 12,225,312 B2Himax Imaging Limited
- Multi-Bandgap Charge-Coupled Device (CCD)2 Jul 2026US 2026/0190512 A1The Board of Regents of the University of Oklahoma
- Near infrared spectrometry device8 Jan 2026US 2026/0009677 A1Tower Semiconductor Ltd.
- Methods for fabricating a multilevel semiconductor device and structure with image sensors and wafer bonding13 Nov 2025US 2025/0351591 A1Monolithic 3D Inc.
- Multilevel semiconductor device and structure with image sensors and wafer bonding7 Nov 2024US 2024/0371906 A1Monolithic 3D Inc.
- Binning system26 Sep 2024US 2024/0323564 A1Himax Imaging Limited
Most cited
By later US patents
- Monolithic imager for near-IR228US 4,198,646 AHughes Aircraft Company · 1980
- Multi-chip imager96US 4,467,342 ARCA Corporation · 1984
- Visible/infrared imaging device with stacked cell structure91US 4,651,001 AKabushiki Kaisha Toshiba · 1987
- Method of batch-fabricating flip-chip bonded dual integrated circuit arrays90US 4,416,054 AWestinghouse Electric Corp. · 1983
- Infrared detector and imaging system67US 4,670,653 ARockwell International Corporation · 1987