H10F 39/021
Of image sensors having active layers comprising only group iii-v materials
Official title: {of image sensors having active layers comprising only Group III-V materials, e.g. GaAs, AlGaAs or InP}
H10F39/021 (Of image sensors having active layers comprising only group iii-v materials) appears on 242 US grants and 279 published applications in this corpus.
Search patents in H10F- Granted patents
- 242
- Published applications
- 279
- Assignees
- 104
- Inventors
- 426
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 3 |
| 2004 | 2 | 2 |
| 2005 | 2 | 3 |
| 2006 | 1 | 0 |
| 2007 | 2 | 1 |
| 2008 | 1 | 4 |
| 2009 | 2 | 6 |
| 2010 | 3 | 4 |
| 2011 | 4 | 5 |
| 2012 | 5 | 8 |
| 2013 | 8 | 6 |
| 2014 | 7 | 14 |
| 2015 | 10 | 11 |
| 2016 | 14 | 16 |
| 2017 | 13 | 14 |
| 2018 | 23 | 28 |
| 2019 | 17 | 28 |
| 2020 | 17 | 29 |
| 2021 | 32 | 22 |
| 2022 | 27 | 21 |
| 2023 | 8 | 23 |
| 2024 | 15 | 15 |
| 2025 | 14 | 14 |
| 2026 | 11 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lidar system with polygon mirror1 Sep 2026US 12,724,149 B2Microvision, Inc.
- Light receiving element array having a laminated semiconductor structure and manufacturing method therefor4 Aug 2026US 12,701,804 B2Rohm Co., Ltd.
- Solid-state imaging device, package, and imaging system26 May 2026US 12,641,349 B2Sony Semiconductor Solutions Corporation
- Optoelectronic device integrated with multilayer thin-film circuitry26 May 2026US 12,641,895 B2Lumiode, Inc.
- Integration of a detection circuit based on optical resonators interconnected on a readout circuit of an imager12 May 2026US 12,628,456 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Photodetection device and electronic device11 Jun 2026US 2026/0164821 A1Sony Semiconductor Solutions Corporation
- Electronic device21 May 2026US 2026/0143837 A1STMicroelectronics International N. V.
- Spatial Phase Integrated Wafer-Level Imaging18 Dec 2025US 2025/0386609 A1Photon-X, Inc.
- Method of manufacturing lidar sensor for mobile device20 Nov 2025US 2025/0355091 A1Aeluma, Inc.
- Method of manufacturing photodetector module comprising emitter and receiver20 Nov 2025US 2025/0359365 A1Aeluma, Inc.
Most cited
By later US patents
- Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices287US 5,401,983 AGeorgia Tech Research Corporation · 1995
- Low profile lidar scanner with polygon mirror119US 10,571,567 B2Luminar Technologies, Inc. · 2020
- Concurrent scan of multiple pixels in a lidar system equipped with a polygon mirror107US 10,310,058 B1Luminar Technologies, Inc. · 2019
- Scan sensors on the exterior surfaces of a vehicle106US 10,502,831 B2Luminar Technologies, Inc. · 2019
- Reducing audio noise in a lidar scanner with a polygon mirror98US 10,324,185 B2Luminar Technologies, Inc. · 2019