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  1. Technology classes
  2. /H · Electricity
  3. /H10 · Semiconductor devices
  4. /H10D · Inorganic electric semiconductor devices
  5. /H10D 80/00 · Assemblies of multiple devices comprising at least one device covered by this
  6. /H10D 80/20 · The at least one device being covered by groups h10d1/00 - h10d48/00
  7. /H10D 80/211 · Resistors, capacitors or inductors covered by h10d1/00
  8. /H10D 80/213
H10D 80/213

Resistors

Official title: {Resistors}

H10D80/213 (Resistors) appears on 1 US grants and 15 published applications in this corpus.

Search patents in H10D

Where it sits

  1. HElectricity
  2. H10Semiconductor devices
  3. H10DInorganic electric semiconductor devices
  4. H10D 80/00Assemblies of multiple devices comprising at least one device covered by this
  5. H10D 80/20The at least one device being covered by groups h10d1/00 - h10d48/00
  6. H10D 80/211Resistors, capacitors or inductors covered by h10d1/00
  7. H10D 80/213Resistors
Granted patents
1
Published applications
15
Assignees
14
Inventors
53
Latest grant
24 Mar 2026

Filings by year

Granted patentsPublished applications
H10D 80/213: granted patents and published applications per publication year
YearGranted patentsPublished applications
202301
202400
202502
2026112

2023202420252026

By publication year. 2026 runs to 8 Oct.

Recent patents

  • Multi-chip semiconductor switching device24 Mar 2026US 12,588,552 B2Fuji Electric Co., Ltd.
  • High-speed signal stabilization in a common substrate24 Sep 2026US 2026/0293693 A1Micron Technology, Inc.
  • Hot-swappable computer fan10 Sep 2026US 2026/0271221 A1Aivres Systems Inc.
  • Optical module and fabrication method for hybrid inp/si optical chip30 Jul 2026US 2026/0219462 A1Hisense Broadband Multimedia Technologies Co., Ltd.
  • Rf switch structure design using local body bias techniques for reduced area23 Jul 2026US 2026/0213746 A1Qorvo US, Inc.
  • Semiconductor device23 Jul 2026US 2026/0214919 A1Rohm Co., Ltd.

Most cited

By later US patents

No patent in this class has been cited by a later US patent yet.

Top assignees

Documents
  • Denso Corporation2
  • Fuji Electric Co., Ltd.2
  • ASAivres Systems Inc.1
  • GSGaNrich Semiconductor Corporation1
  • HBHisense Broadband Multimedia Technologies Co., Ltd.1
  • Micron Technology, Inc.1
  • MTMIRISE Technologies Corporation1
  • Monolithic Power Systems, Inc.1
  • Murata Manufacturing Co., Ltd.1
  • NUNXP USA, Inc.1

Often classified with

  • H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by12
  • H05KPrinted circuits4
  • H02MApparatus for conversion between ac and ac, between ac and dc, or3
  • H03KPulse technique2
  • G01KMeasuring temperature1
  • G01RMeasuring electric variables1
  • G02BOptical elements, systems or apparatus1
  • G02FOptical devices or arrangements for the control of light by modification of1
  • G05FSystems for regulating electric or magnetic variables1
  • G06FComputing and data processing1

Documents that also carry the other class.

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© 2026 patentgrepData from USPTO bulk files