H10D 48/387
Devices controllable only by the variation of applied heat
Official title: {Devices controllable only by the variation of applied heat}
H10D48/387 (Devices controllable only by the variation of applied heat) appears on 43 US grants and 21 published applications in this corpus.
Search patents in H10D- Granted patents
- 43
- Published applications
- 21
- Assignees
- 34
- Inventors
- 92
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 2 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 4 |
| 2021 | 2 | 2 |
| 2022 | 2 | 1 |
| 2023 | 2 | 0 |
| 2024 | 2 | 0 |
| 2025 | 1 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor circuit and method for determining a temperature of a power semiconductor component17 Mar 2026US 12,578,235 B2Infineon Technologies AG
- Photon number resolving detector with thermal diode11 Mar 2025US 12,249,641 B1Psiquantum, Corp.
- Device and method for manufacturing device9 Apr 2024US 11,955,539 B2Mitsubishi Electric Corporation
- Semiconductor device16 Jan 2024US 11,876,131 B2Fuji Electric Co., Ltd.
- Thermal diode switch24 Oct 2023US 11,799,020 B1Psiquantum, Corp.
- Semiconductor package with pre-formed die clip and lead frame2 Jan 2025US 2025/0006583 A1Tesla, Inc.
- Semiconductor package with nested lead structure2 Jan 2025US 2025/0006600 A1Tesla, Inc.
- Semiconductor package with directional locking structure2 Jan 2025US 2025/0006602 A1Tesla, Inc.
- Device and method for manufacturing device30 Jun 2022US 2022/0208997 A1Mitsubishi Electric Corporation
- Power semiconductor device and manufacturing method thereof12 Aug 2021US 2021/0249526 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Field effect transistor having a surface channel and its method of operation39US 4,219,829 ASiemens Aktiengesellschaft · 1980
- Flow sensor on insulator35US 4,744,246 A1988
- Semiconductor temperature switches23US 3,971,056 ACutler-Hammer, Inc. · 1976
- Semiconductor thermally sensitive switch structure19US 4,009,482 AMitsubishi Denki Kabushiki Kaisha · 1977
- Integrated thermally sensitive power switching semiconductor device, including a thermally self-protected version17US 4,050,083 ACutler-Hammer, Inc. · 1977