Semiconductor package with pre-formed die clip and lead frame
AssigneeTesla, Inc.
InventorsWilliam Thomas Chi, Utkarsh Raheja, Sesha Sai Srikant Sarma Gandikota
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Abstract
The present disclosure relates to a semiconductor package with a pre-formed die clip and lead frame. The semiconductor package includes a semiconductor die, a heat spreader on a first side of the semiconductor die, a lead frame on a second side of the semiconductor die, and a die clip positioned between the semiconductor die and a portion of the lead frame. The die clip and the lead frame are pre-joined by way of various connection points.
Claims20
A semiconductor package with a dual sided heat dissipation structure, the semiconductor package comprising:
- a semiconductor die having a first side and a second side, the second side being opposite to the first side;
- a heat spreader on the first side of the semiconductor die;
- a lead frame on the second side of the semiconductor die;
- and
- a die clip positioned between the semiconductor die and a portion of the lead frame, wherein the die clip and the lead frame are joined at connection points.
A method of assembling a semiconductor package, the method comprising:
- joining a die clip with a lead frame at a plurality of connection points;
- and
- after the joining, soldering the die clip to a semiconductor die,
- wherein the die clip and the lead frame are on an opposite side of the semiconductor die than a heat spreader after the soldering.
Dependencies are inferred from the claim text.