H10D 1/20
Inductors
H10D1/20 (Inductors) appears on 1,969 US grants and 2,472 published applications in this corpus.
Search patents in H10D- Granted patents
- 1,969
- Published applications
- 2,472
- Assignees
- 474
- Inventors
- 3,464
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 13 | 0 |
| 2000 | 17 | 0 |
| 2001 | 28 | 20 |
| 2002 | 45 | 49 |
| 2003 | 42 | 64 |
| 2004 | 44 | 51 |
| 2005 | 40 | 65 |
| 2006 | 43 | 33 |
| 2007 | 32 | 85 |
| 2008 | 60 | 74 |
| 2009 | 24 | 58 |
| 2010 | 48 | 48 |
| 2011 | 47 | 50 |
| 2012 | 40 | 57 |
| 2013 | 61 | 77 |
| 2014 | 72 | 122 |
| 2015 | 94 | 112 |
| 2016 | 116 | 128 |
| 2017 | 137 | 115 |
| 2018 | 118 | 145 |
| 2019 | 119 | 130 |
| 2020 | 126 | 159 |
| 2021 | 94 | 132 |
| 2022 | 107 | 132 |
| 2023 | 104 | 127 |
| 2024 | 109 | 153 |
| 2025 | 96 | 161 |
| 2026 | 77 | 125 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductance element and inductance element fabrication method6 Oct 2026US 12,755,886 B2Lapis Semiconductor Co., Ltd.
- Semiconductor device and semiconductor device fabrication method6 Oct 2026US 12,757,726 B2Lapis Semiconductor Co., Ltd.
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- High-performance power supply module29 Sep 2026US 12,750,967 B2MetaPWR Electronics Co., Ltd.
- Semiconductor device structure and method for forming the same8 Oct 2026US 2026/0313921 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with polygonal inductive device8 Oct 2026US 2026/0314371 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for forming the same8 Oct 2026US 2026/0314394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-turn distributed active transformer power combiner1 Oct 2026US 2026/0302042 A1Texas Instruments Incorporated
- Electronic device1 Oct 2026US 2026/0305315 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Method of forming a three-dimensional integrated inductor247US 6,008,102 AMotorola, Inc. · 1999
- Inductive structures for semiconductor integrated circuits217US 5,095,357 AMitsubishi Denki Kabushiki Kaisha · 1992
- Top layers of metal for high performance IC's207US 6,383,916 B12002
- Transformer for integrated circuits191US 6,031,445 ASTMicroelectronics S.r.l. · 2000
- Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer190US 9,530,709 B2Qorvo US, Inc. · 2016