H05K 7/20818
Within cabinets for removing heat from server blades
Official title: {within cabinets for removing heat from server blades}
H05K7/20818 (Within cabinets for removing heat from server blades) appears on 405 US grants and 556 published applications in this corpus.
Search patents in H05K- Granted patents
- 405
- Published applications
- 556
- Assignees
- 180
- Inventors
- 836
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 1 |
| 2006 | 3 | 4 |
| 2007 | 0 | 1 |
| 2008 | 0 | 3 |
| 2009 | 0 | 6 |
| 2010 | 5 | 6 |
| 2011 | 6 | 4 |
| 2012 | 5 | 12 |
| 2013 | 2 | 10 |
| 2014 | 3 | 20 |
| 2015 | 11 | 13 |
| 2016 | 18 | 21 |
| 2017 | 15 | 17 |
| 2018 | 15 | 18 |
| 2019 | 25 | 16 |
| 2020 | 26 | 38 |
| 2021 | 29 | 34 |
| 2022 | 32 | 74 |
| 2023 | 53 | 82 |
| 2024 | 65 | 65 |
| 2025 | 58 | 57 |
| 2026 | 24 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Immersion cooling system15 Sep 2026US 12,740,013 B2Aewin Technologies Co., Ltd.
- Two-phase liquid cooling system, two-phase liquid cooling cabinet, and method for liquid cooling of electronic devices15 Sep 2026US 12,740,016 B2Fulian Precision Electronics (Tianjin) Co., LTD.
- Data center infrastructure modularization systems and methods1 Sep 2026US 12,727,124 B2Nautilus TRUE, LLC
- Cooling interface for a pluggable module18 Aug 2026US 12,713,561 B2Hewlett Packard Enterprise Development LP
- Cold plate with folded heat dissipation features for datacenter cooling systems11 Aug 2026US 12,707,595 B2NVIDIA Corporation
- Gas-liquid phase change carbon dioxide energy comprehensive utilization system adapted for data center8 Oct 2026US 2026/0313854 A1Exax Energy Technology (Shenzhen) Co., Ltd
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Equalizing flow manifold with bernoulli-derived hierarchical geometry, asymmetric inlet/outlet architectures, and modular polygonal flow units, and cooling apparatus including same24 Sep 2026US 2026/0293054 A1HRL Laboratories, LLC
- Interchangeable coolant-calibrated in-rack coolant distribution units in datacenter cooling systems17 Sep 2026US 2026/0282297 A1NVIDIA Corporation
- Cooling System of Cabinet and the Method of Cooling the Cabinet10 Sep 2026US 2026/0271244 A1Holthrone Co., Ltd.
Most cited
By later US patents
- Thermal management system and method for electronics system73US 6,657,121 B2Thermal Corp. · 2003
- Cooling system and electronic equipment71US 10,408,545 B2NEC Platforms, Ltd. · 2019
- Thermal bus for electronics systems70US 6,804,117 B2Thermal Corp. · 2004
- Sub-dew point cooling of electronic systems58US 6,205,796 B1International Business Machines Corporation · 2001
- Cold plate for dual refrigeration systems55US 5,896,922 AInternational Business Machines Corporation · 1999