Thermal bus for electronics systems

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from said heat generating structure;
• a second thermal energy transfer assembly having a second thermal interface surface arranged in confronting relation to said first thermal interface surface;
• and
• a clamping mechanism arranged to move said second thermal interface surface between (i) a first position that is spaced away from said first thermal interface surface, and (ii) a second position wherein said second thermal interface surface is pressed against said first thermal interface surface so as to allow the busing of thermal energy from said first thermal energy transfer assembly to said second thermal energy transfer assembly by heat transfer from said first thermal interface surface to said second thermal interface surface.

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• at least one card-level cooling assembly including at least one thermal saddle arranged in thermal engagement with a heat generating structure, a cold plate having a first thermal interface surface, and a heat pipe thermally coupled to said at least one thermal saddle and said cold plate;
• at least one heat exchanger having a second thermal interface surface arranged in confronting relation to said first thermal interface surface;
• and
• a clamping mechanism arranged to move said second thermal interface surface between (i) a first position that is spaced away from said first thermal interface surface, and (ii) a second position wherein said second thermal interface surface is pressed against said first thermal interface surface so as to allow the busing of thermal energy from said at least one card-level cooling assembly to said at least one heat exchanger by heat transfer from said first thermal interface surface to said second thermal interface surface.

A thermal bus junction arranged within an electronics system for transporting thermal energy in a directed manner from one location to another location comprising:

• a cold plate having a portion of at least one heat pipe embedded within a first thermal interface surface
• a condenser of a first loop thermosyphon having a second thermal interface surface;
• and
• an evaporator portion of a second loop thermosyphon having a third thermal interface surface releasably pressed against said first and second thermal interface surfaces.

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• at least one card-level cooling assembly including at least one thermal saddle arranged in thermal engagement with a heat generating structure, a cold plate having a first thermal interface surface, and a heat pipe thermally coupled to said at least one thermal saddle and said cold plate;
• at least one loop thermosyphon having a second thermal interface surface disposed upon a evaporator and arranged in confronting relation to said first thermal interface surface;
• and
• a clamping mechanism arranged to move said second thermal interface surface between (i) a first position that is spaced away from said first thermal interface surface, and (ii) a second position wherein said second thermal interface surface is pressed against said first thermal interface surface so as to allow the busing of thermal energy from said at least one card-level cooling assembly to said at least one loop thermosyphon by heat transfer from said first thermal interface surface to said second thermal interface surface.

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• at least one card-level cooling assembly including at least one loop thermosyphon having a first thermal interface surface disposed upon a condenser;
• at least a second loop thermosyphon having a second thermal interface surface disposed upon a second evaporator and arranged in confronting relation to said first thermal interface surface;
• and
• a clamping mechanism arranged to move said second thermal interface surface between (i) a first position that is spaced away from said first thermal interface surface, and (ii) a second position wherein said second thermal interface surface is pressed against said first thermal interface surface so as to allow the busing of thermal energy from said at least one card-level cooling assembly to said at least a second loop thermosyphon by heat transfer from said first thermal interface surface to said second thermal interface surface.

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from said heat generating structure;
• a second thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a second thermal interface surface that is spaced away from said heat generating structure;
• a third thermal energy transfer assembly having a third thermal interface surface arranged in confronting relation to said first and second thermal interface surfaces;
• and
• a clamping mechanism arranged to move said third thermal interface surface between (i) a first position that is spaced away from said first and second thermal interface surfaces, and (ii) a second position wherein said third thermal interface surface is pressed against said first and second thermal interface surfaces so as to allow the busing of thermal energy from said first and second thermal energy transfer assemblies to said third thermal energy transfer assembly by heat transfer from said first and second thermal interface surfaces to said third thermal interface surface.

A thermal management system for an electronic device having one or more circuit cards arranged within an enclosure, said thermal management system comprising:

• a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from said heat generating structure, and has an exposed height of about one and three-quarter inches;
• a second thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a second thermal interface surface that is spaced away from said heat generating structure and has an exposed height of about one and three-quarter inches;
• a third thermal energy transfer assembly having a third thermal interface surface arranged in confronting relation to said first and second thermal interface surfaces, and has an exposed height of about one and three-quarter inches;
• and
• a clamping mechanism arranged to move said third thermal interface surface between (i) a first position that is spaced away from said first and second thermal interface surfaces, and (ii) a second position wherein said third thermal interface surface is pressed against said first and second thermal interface surfaces so as to allow the busing of thermal energy from said first and second thermal energy transfer assemblies to said third thermal energy transfer assembly by heat transfer from said first and second thermal interface surfaces to said third thermal interface surface.