H05K 7/20663
Liquid coolant with phase change
Official title: {Liquid coolant with phase change, e.g. heat pipes}
H05K7/20663 (Liquid coolant with phase change) appears on 193 US grants and 207 published applications in this corpus.
Search patents in H05K- Granted patents
- 193
- Published applications
- 207
- Assignees
- 149
- Inventors
- 526
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 5 | 2 |
| 2003 | 3 | 6 |
| 2004 | 4 | 2 |
| 2005 | 2 | 4 |
| 2006 | 2 | 5 |
| 2007 | 4 | 4 |
| 2008 | 5 | 7 |
| 2009 | 1 | 3 |
| 2010 | 2 | 7 |
| 2011 | 7 | 10 |
| 2012 | 3 | 11 |
| 2013 | 5 | 10 |
| 2014 | 5 | 4 |
| 2015 | 7 | 18 |
| 2016 | 10 | 9 |
| 2017 | 5 | 20 |
| 2018 | 16 | 9 |
| 2019 | 17 | 9 |
| 2020 | 11 | 13 |
| 2021 | 12 | 11 |
| 2022 | 5 | 6 |
| 2023 | 11 | 13 |
| 2024 | 9 | 9 |
| 2025 | 9 | 10 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dual-inverter assembly19 May 2026US 12,635,102 B2Delta Electronics, Inc.
- Immersion cooling system with baffle assembly with side plates and guiding plates12 May 2026US 12,628,313 B2Wiwynn Corporation
- Systems and methods for electronics cooling24 Mar 2026US 12,588,164 B2Eagle Technology, LLC
- Heat dissipation cabinet and communications device24 Feb 2026US 12,563,699 B2Huawei Technologies Co., Ltd.
- Heat dissipating device20 Jan 2026US 12,532,434 B2Korea Advanced Institute of Science and Technology
- Enclosed phase change immersion cooling30 Jul 2026US 2026/0223326 A1Hewlett Packard Enterprise Development LP
- Electronic assemblies having embedded passive heat pipes and associated method16 Apr 2026US 2026/0107372 A1Eagle Technology, LLC
- Air conditioner arrangement with thermal conduction heat exchanger5 Mar 2026US 2026/0066626 A1Pfannenberg GmbH
- Method and apparatus for cooling system19 Feb 2026US 2026/0052656 A1NextAire, LLC
- Electronics cooling system18 Dec 2025US 2025/0386458 A1Raytheon Company
Most cited
By later US patents
- Panel mounted cooling system241US 5,657,641 AKooltronic, Inc. · 1997
- Electronic enclosure cooling system178US 6,462,949 B1ThermoTek, Inc. · 2002
- Modular cooling system and thermal bus for high power electronics cabinets119US 6,828,675 B2Modine Manufacturing Company · 2004
- Electronic unit96US 5,842,514 ANorthern Telecom Limited · 1998
- Electronic packaging module utilizing phase-change conductive cooling95US 4,493,010 ALockheed Corporation · 1985