H05K 7/20672
Within sub-racks for removing heat from electronic boards
Official title: {within sub-racks for removing heat from electronic boards}
H05K7/20672 (Within sub-racks for removing heat from electronic boards) appears on 88 US grants and 82 published applications in this corpus.
Search patents in H05K- Granted patents
- 88
- Published applications
- 82
- Assignees
- 73
- Inventors
- 221
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 3 |
| 2007 | 3 | 1 |
| 2008 | 5 | 2 |
| 2009 | 1 | 2 |
| 2010 | 0 | 2 |
| 2011 | 3 | 3 |
| 2012 | 1 | 2 |
| 2013 | 3 | 4 |
| 2014 | 1 | 3 |
| 2015 | 2 | 5 |
| 2016 | 6 | 7 |
| 2017 | 3 | 8 |
| 2018 | 9 | 4 |
| 2019 | 7 | 3 |
| 2020 | 6 | 4 |
| 2021 | 4 | 4 |
| 2022 | 2 | 3 |
| 2023 | 4 | 5 |
| 2024 | 4 | 3 |
| 2025 | 4 | 6 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for electronics cooling24 Mar 2026US 12,588,164 B2Eagle Technology, LLC
- Heat dissipating device20 Jan 2026US 12,532,434 B2Korea Advanced Institute of Science and Technology
- Systems and methods for using additive manufacturing for thermal management13 Jan 2026US 12,526,959 B2General Electric Company
- Computing system with cooling for controlling temperature of electronic components24 Jun 2025US 12,342,454 B2Microsoft Technology Licensing, LLC
- Electronic assemblies having embedded passive heat pipes and associated method20 May 2025US 12,309,912 B2Eagle Technology, LLC
- Electronic assemblies having embedded passive heat pipes and associated method16 Apr 2026US 2026/0107372 A1Eagle Technology, LLC
- Method and apparatus for cooling system19 Feb 2026US 2026/0052656 A1NextAire, LLC
- Cold plate with high-aspect ratio micro- or nano-tubes, and associated methods and systems20 Nov 2025US 2025/0358963 A1CoolIT Systems, Inc.
- Heatsink for co-packaged optical switch rack package10 Jul 2025US 2025/0227888 A1Marvell Asia Pte Ltd
- Container for One or More Electronic Devices and Methods of Use Thereof3 Jul 2025US 2025/0220856 A1Engendren Corporation
Most cited
By later US patents
- Electronic unit96US 5,842,514 ANorthern Telecom Limited · 1998
- Electronic module with self-activated heat pipe90US 4,777,561 AHughes Aircraft Company · 1988
- Cooling system81US 5,329,425 AAlcatel · 1994
- Heat pipe thermal mounting plate for cooling electronic circuit cards80US 4,118,756 AHughes Aircraft Company · 1978
- Heat-producing elements with heat pipes65US 4,449,576 AKabel-und Metallwerke · 1984