Computing system with cooling for controlling temperature of electronic components

A cooling system for a computing device, comprising:

• a printed circuit board having a top and a bottom;
• an integrated circuit component coupled to the top of the printed circuit board;
• a heat sink coupled to the top of the printed circuit board and spaced from the integrated circuit component;
• a voltage regulator coupled to the printed circuit board (1) below the top of the printed circuit board and (2) directly below the integrated circuit component;
• a single condenser (1) directly thermally coupled to the heat sink coupled to the top of the printed circuit board and (2) directly thermally coupled to the voltage regulator coupled to printed circuit board below the top of the printed circuit board;
• and
• at least one heat pipe comprising an evaporator portion and a condenser portion and defined as a single conduit between an evaporator end and a condenser end, the evaporator end adjacent the voltage regulator, the heat pipe extending away from the evaporator end and along the bottom of the printed circuit board to the condenser end at a first vertical position that is higher than a second vertical position of the top of the printed circuit board, wherein heat from the voltage regulator is moved away from the voltage regulator and the integrated circuit component to the heat sink.

A computing system, comprising:

• a chassis;
• a printed circuit board housed within the chassis, the printed circuit board having a top and a bottom;
• a central processing unit coupled to the top of the printed circuit board;
• at least one fan within the chassis that moves air at least over the top of the printed circuit board;
• a heat sink coupled to the top of the printed circuit board and spaced from the central processing unit, the at least one fan moving air over the heat sink;
• a voltage regulator coupled to the bottom of the printed circuit board and directly below the central processing unit;
• a single condenser (1) directly thermally coupled to the heat sink coupled to the top of the printed circuit board and (2) directly thermally coupled to the voltage regulator coupled to the bottom of the printed circuit board;
• and
• at least one heat pipe comprising an evaporator portion and a condenser portion and defined as a single conduit between an evaporator end and a condenser end, the evaporator end adjacent the voltage regulator, the at least one heat pipe extending away from the evaporator end and along the bottom of the printed circuit board to the condenser end at a first vertical position that is higher than a second vertical position of the top of the printed circuit board, wherein heat from the voltage regulator is moved away from the voltage regulator and the central processing unit to the heat sink.