Cooling system
AssigneeAlcatel
InventorsFrancois J. C. Leyssens, Hendrikus M. J. Rombouts
Life of this patent
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Abstract
A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, includes a heat exchanger for delivering heat to a cooling medium and a heat pipe for transferring heat from each thermal sink to the heat exchanger. The heat pipe includes at least one flat box-shaped heat pipe, at least a first part of the heat pipe being in thermal contact with the longitudinal sides of the thermal sinks of the circuit boards.
Claims3
A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, said cooling system including:
- a heat exchanger for delivering heat to a cooling medium;
- and
- a flat box-shaped heat pipe for transferring heat from thermal sinks to said heat exchanger, at least a first part of said heat pipe for thermally contacting longitudinal sides of thermal sinks of circuit boards;
- wherein grooves are provided in thermal contact with said flat box-shaped heat pipe, for receiving longitudinal sides of thermal sinks of circuit boards;
- and
- wherein said grooves are provided in said box-shaped heat pipe.
Dependencies are inferred from the claim text.