Electronic assemblies having embedded passive heat pipes and associated method
AssigneeEagle Technology, LLC
InventorJason Thompson
Life of this patent
Estimating the term…
Abstract
An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.
Claims7
A method for making an electronic module to be mounted within a chassis, the method comprising:
- 3D printing a heat sink body by Fused Deposition Modeling (FDM);
- coupling the 3D printed heat sink body to a plurality of heat-generating electronic components on a circuit substrate, the 3D printed heat sink body having opposing ends and opposing side edges extending between the opposing ends, the 3D printed heat sink body having a plurality of heat pipe receiving passageways extending therethrough between opposing side edges and overlying corresponding ones of the heat-generating components;
- 3D printing a plurality of heat pipes by FDM;
- and
- fastening a respective 3D printed heat pipe extending within each heat pipe receiving passageway.
Dependencies are inferred from the claim text.