Heat dissipation cabinet and communications device

A heat dissipation cabinet comprising:

• a cabinet body;
• and
• at least one heat dissipation apparatus, wherein
• the cabinet body has a first accommodation region and a second accommodation region;
• the first accommodation region is configured to accommodate at least one plugboard with heat source components;
• the heat dissipation apparatus comprises at least one evaporator, at least one condenser, an evaporation pipeline a liquid return pipeline and a fan;
• the evaporator is configured to be in thermal contact with an outer surface of one or more of the heat source components;
• the condenser is disposed in the second accommodation region and is located above the evaporator, in the heat dissipation apparatus;
• the evaporator is connected to the condenser through the evaporation pipeline and the liquid return pipeline to form a beat exchange loop;
• the fan is configured to dissipate heat of the condenser through air cooling;
• in a same heat dissipation apparatus, the evaporator has a first inlet end and a first outlet end, the condenser has a second inlet end and a second outlet end, two ends of the evaporation pipeline are respectively connected to the first outlet end and the second inlet end, and two ends of the liquid return pipeline are respectively connected to the second outlet end and the first inlet end;
• the second inlet end of the condenser is detachably connected to the evaporation pipeline via a first switching connector;
• and
• the second outlet end of the condenser is detachably connected to the liquid return pipeline via a second switching connector.