Electronic enclosure cooling system

A modular low profile unit for use in a cooling system for removing heat from at least one heat generating component, said modular low profile unit comprising:

• a heat sink in contact with said at least one heat generating component;
• at least one low profile extrusion of unitary construction having an exterior surface in contact with said heat sink and adapted for receiving heat from said heat sink being formed with a unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes being provided with a microtube inlet and a microtube outlet;
• a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion;
• a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;
• at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold;
• at least one fluid outlet provided on one of said first fluid manifold and said second fluid manifold;
• and
• a quick connect coupling in communication with said at least one fluid outlet.

A cooling fluid backplane comprising:

• at least one low profile extrusion of unitary construction having an exterior surface adapted for receiving heat from a heat sink and being formed with a unitary array, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes having a microtube inlet and a microtube outlet;
• a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion;
• and
• a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;
• at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold;
• and
• at least one fluid outlet provides on one of said first fluid manifold and said second fluid manifold.

A method of cooling an electronic enclosure having heat generating electronic components therein with a closed loop, liquid cooling system, said method comprising the steps of:

• mounting said heat generating electronic components to a first side of at least one heat sink;
• affixing said heat sink and said heat generating electronic components to a cooling fluid backplane comprised of at least one low profile extrusion being formed with a unitary array, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, wherein said heat sink and said cooling fluid backplane comprise a modular low profile unit;
• placing said modular low profile unit within an enclosure adapted to receive said modular low profile unit;
• conducting heat from said at least one heat sink into said cooling fluid backplane;
• circulating a heat transfer fluid throughout said cooling fluid backplane;
• passing said heat transfer fluid through a heat exchanger;
• and
• recirculating the heat transfer fluid throughout the cooling fluid backplane and the heat exchanger to form a closed loop and to thereby cool said heat generating electronic components.