Modular cooling system and thermal bus for high power electronics cabinets

A cooling module for use in a modular cooling system of an electronics enclosure mounting a plurality of heat generating electronic components, the cooling system including a cooling liquid supply manifold and a cooling liquid return manifold;

• the cooling module comprising:
• an evaporative cold plate including a cold plate inlet, a cold plate outlet, and an evaporative flow path to direct a working fluid flow from the cold plate inlet to the cold plate outlet in heat exchange relation with electronic components associated with the cold plate to reject heat from the electronic components to the working fluid flow,
• a condenser including a working fluid inlet, a working fluid outlet, a condensing flow path to direct the working fluid flow through the condenser from the working fluid inlet to the working fluid outlet, a cooling liquid inlet connection configured to releasably connect to the cooling liquid supply manifold to receive cooling liquid therefrom, a cooling liquid outlet connection configured to releasably connect to the cooling liquid return manifold to deliver cooling liquid thereto, and a cooling liquid flow path to direct a cooling liquid through the condenser from the cooling liquid inlet to the cooling liquid outlet in heat exchange relation with the working fluid flow in the condensing flow path to heat from the working fluid flow to the cooling liquid,
• a vapor conduit connecting the cold plate outlet to the working fluid inlet to direct vapor phase working fluid from the evaporative cold plate to the condenser, and
• a liquid conduit connecting the working fluid outlet to the cold plate inlet to direct liquid phase working fluid from the condenser to the evaporative cold plate.

A modular cooling system for an electronics enclosure mounting a plurality of heat generating electronic components;

• the cooling system comprising:
• a plurality of cooling modules selectively mountable into the electronics enclosure, each of the cooling modules comprising
• an evaporative cold plate including an evaporative flow path to direct a working fluid through the cold plate in heat exchange relation with electronic components associated with the cold plate to reject heat from the electronic components to the working fluid,
• a condenser including a condensing flow path to direct the working fluid through the condenser in heat exchange relation with a cooling fluid to reject heat from the working fluid to the cooling fluid,
• a vapor conduit connecting the evaporative cold plate to the condenser to direct vapor phase working fluid from the evaporative flow path to the condensing flow path, and
• a liquid conduit connecting the condenser to the evaporative cold plate to direct liquid phase working fluid from the condensing flow path to the evaporative flow path,
• a cooling fluid supply manifold to direct the cooling fluid to each of the condensers;
• a cooling fluid return manifold to direct the cooling fluid from each of the condensers;
• and
• a wall positioned in the electronics enclosure to separate the electronic components and evaporative cold plates from the cooling fluid supply and return manifolds and the condensers of each of said cooling modules to shield the electronic components from the cooling fluid should the cooling fluid leak from the system, the wall including a plurality of notches through which the vapor and liquid conduits may pass, each of said notches is formed in a side of said wall to allow the vapor and fluid conduits of one of said cooling modules to be inserted into the electronics enclosure without disconnecting the vapor and liquid conduits from the condenser and evaporative cold plate of said one of said cooling modules.

A modular cooling system for an electronics enclosure mounting a plurality of heat generating electronic components;

• the cooling system comprising:
• a plurality of cooling modules selectively mountable into the electronics enclosure, each of the cooling modules comprising
• an evaporative cold plate including an evaporative flow path to direct a working fluid through the cold plate in heat exchange relation with electronic components associated with the cold plate to reject heat from the electronic components to the working fluid,
• a condenser including a condensing flow path to direct the working fluid flow through the condenser in heat exchange relation with a cooling liquid to reject heat from the working fluid to the cooling liquid,
• a vapor conduit connecting the evaporative cold plate to the condenser to direct vapor phase working fluid from the evaporative flow path to the condensing flow path, and
• a liquid conduit connecting the condenser to the evaporative cold plate to direct liquid phase working fluid from the condensing flow path to the evaporative flow path,
• a cooling liquid supply manifold to direct the cooling liquid to each of the condensers;
• a cooling liquid return manifold to direct the cooling liquid from each of the condensers;
• and
• a wall positioned in the electronics enclosure to separate the electronic components and evaporative cold plates from the cooling liquid supply and return manifolds and the condensers of each of said cooling modules to shield the electronic components from the cooling liquid should the cooling liquid leak from the system.