H05K 7/20218
Using a liquid coolant without phase change in electronic enclosures
Official title: {using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
H05K7/20218 (Using a liquid coolant without phase change in electronic enclosures) appears on 3,009 US grants and 4,685 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,009
- Published applications
- 4,685
- Assignees
- 1,163
- Inventors
- 7,119
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 7 | 2 |
| 2002 | 9 | 7 |
| 2003 | 4 | 3 |
| 2004 | 3 | 11 |
| 2005 | 2 | 13 |
| 2006 | 12 | 21 |
| 2007 | 13 | 29 |
| 2008 | 8 | 25 |
| 2009 | 6 | 29 |
| 2010 | 17 | 38 |
| 2011 | 28 | 45 |
| 2012 | 27 | 56 |
| 2013 | 32 | 94 |
| 2014 | 39 | 111 |
| 2015 | 75 | 133 |
| 2016 | 117 | 158 |
| 2017 | 115 | 164 |
| 2018 | 140 | 173 |
| 2019 | 181 | 230 |
| 2020 | 212 | 266 |
| 2021 | 234 | 296 |
| 2022 | 237 | 426 |
| 2023 | 279 | 486 |
| 2024 | 366 | 588 |
| 2025 | 477 | 618 |
| 2026 | 287 | 663 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for1,544
- H05K 7/20254Cold plates transferring heat from heat source to coolant1,190
- H05K 7/20236By immersion566
- H05K 7/20263Heat dissipaters releasing heat from coolant494
- H05K 7/20281Thermal management400
- H05K 7/20245By natural convection49
Recent patents
- Auxiliary system for a low-temperature thermal energy distribution network6 Oct 2026US 12,753,933 B2Apterix SA
- Cold plate and method for manufacturing cold plate6 Oct 2026US 12,753,978 B2Fujikura Ltd.
- Immersion cooling system6 Oct 2026US 12,757,352 B2Wiwynn Corporation
- Data center cooling system using one or more cooling loops6 Oct 2026US 12,757,358 B1NVIDIA Corporation
- Cooling device6 Oct 2026US 12,757,360 B2Erwin Quarder Systemtechnik GmbH
- Propylene Carbonate Based Heat Transfer Fluid8 Oct 2026US 2026/0308436 A1CCI North America Corporation
- Tank assembly8 Oct 2026US 2026/0309171 A1
- Multi-way valve and thermal management system including the same8 Oct 2026US 2026/0309241 A1Hanon Systems
- Floating connector mechanism8 Oct 2026US 2026/0309260 A1Mellanox Technologies, Ltd.
- Connector and electrical assembly for a cooled electrical cable8 Oct 2026US 2026/0312316 A1TE Connectivity Solutions GmbH
Most cited
By later US patents
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Microcomponent chemical process sheet architecture299US 5,811,062 ABattelle Memorial Institute · 1998
- Microcomponent sheet architecture190US 5,611,214 ABattelle Memorial Institute · 1997
- Gas-liquid forced turbulence cooling148US 5,131,233 ACray Computer Corporation · 1992
- Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink141US 6,349,035 B1Compaq Information Technologies Group, L.P. · 2002