H05K 7/20281
Thermal management
Official title: {Thermal management, e.g. liquid flow control}
H05K7/20281 (Thermal management) appears on 400 US grants and 619 published applications in this corpus.
Search patents in H05K- Granted patents
- 400
- Published applications
- 619
- Assignees
- 256
- Inventors
- 1,225
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 0 | 4 |
| 2010 | 3 | 2 |
| 2011 | 4 | 5 |
| 2012 | 2 | 6 |
| 2013 | 1 | 14 |
| 2014 | 4 | 19 |
| 2015 | 12 | 25 |
| 2016 | 24 | 23 |
| 2017 | 15 | 20 |
| 2018 | 13 | 13 |
| 2019 | 19 | 36 |
| 2020 | 27 | 46 |
| 2021 | 36 | 46 |
| 2022 | 40 | 65 |
| 2023 | 39 | 45 |
| 2024 | 46 | 69 |
| 2025 | 48 | 74 |
| 2026 | 44 | 96 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Auxiliary system for a low-temperature thermal energy distribution network6 Oct 2026US 12,753,933 B2Apterix SA
- Piezoelectric MEMS-based active cooling for heat dissipation in compute devices22 Sep 2026US 12,745,638 B2Frore Systems Inc.
- Magnetically coupled conductive thermal interface1 Sep 2026US 12,722,810 B1The United States of America as represented by the Secretary of the Air Force
- Thermoelectric coupler for selective heat transfer between coolant loops in a device cooling system1 Sep 2026US 12,723,785 B2Microsoft Technology Licensing, LLC
- Water-cooled heat dissipation structure applied to underwater photographic equipment1 Sep 2026US 12,724,330 B2Dongguan Miles Precision Manufacturing Co., Ltd
- Multi-way valve and thermal management system including the same8 Oct 2026US 2026/0309241 A1Hanon Systems
- Regulating in-series thermal dissipation for enhanced system management8 Oct 2026US 2026/0313832 A1Dell Products L. P.
- System and method for providing supplemental power and cooling to one or more components of an electrical load8 Oct 2026US 2026/0313851 A1Toyota Jidosha Kabushiki Kaisha
- Apparatus, systems, and methods of use for an outdoor mounted temperature regulating enclosure1 Oct 2026US 2026/0304691 A1Iceotope Group Limited
- Control device, cooling system, moving object, control method, and storage medium1 Oct 2026US 2026/0304692 A1Honda Motor Co., Ltd.
Most cited
By later US patents
- Dew point sensitive computer cooling system122US 4,512,161 AControl Data Corporation · 1985
- Cooling system for electronic equipment95US 4,729,424 ANEC Corporation · 1988
- Cooling apparatus for use in an electronic system91US 6,182,742 B2Hitachi, Ltd. · 2001
- Nanosecond pulser ADC system76US 10,659,019 B2Eagle Harbor Technologies, Inc. · 2020
- Cooling system for electronic device74US 5,535,818 AFujitsu Limited · 1996