H05K 7/20254
Cold plates transferring heat from heat source to coolant
Official title: {Cold plates transferring heat from heat source to coolant}
H05K7/20254 (Cold plates transferring heat from heat source to coolant) appears on 1,190 US grants and 1,815 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,190
- Published applications
- 1,815
- Assignees
- 583
- Inventors
- 3,207
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 2 |
| 2002 | 6 | 3 |
| 2003 | 3 | 2 |
| 2004 | 3 | 8 |
| 2005 | 1 | 4 |
| 2006 | 5 | 6 |
| 2007 | 5 | 9 |
| 2008 | 1 | 7 |
| 2009 | 4 | 9 |
| 2010 | 5 | 13 |
| 2011 | 10 | 22 |
| 2012 | 8 | 25 |
| 2013 | 14 | 35 |
| 2014 | 20 | 36 |
| 2015 | 28 | 61 |
| 2016 | 46 | 54 |
| 2017 | 47 | 47 |
| 2018 | 50 | 66 |
| 2019 | 64 | 98 |
| 2020 | 87 | 96 |
| 2021 | 94 | 133 |
| 2022 | 99 | 170 |
| 2023 | 104 | 181 |
| 2024 | 165 | 250 |
| 2025 | 190 | 236 |
| 2026 | 93 | 242 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Cold plate and method for manufacturing cold plate6 Oct 2026US 12,753,978 B2Fujikura Ltd.
- Data center cooling system using one or more cooling loops6 Oct 2026US 12,757,358 B1NVIDIA Corporation
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Immersion cold plates with impingement29 Sep 2026US 12,750,973 B2Dell Products L. P.
- Server and server liquid cooling system29 Sep 2026US 12,750,983 B2Inventec Corporation
- Liquid-Cooling Cabinet and Structural Layout Method Therefor, and Electronic Device8 Oct 2026US 2026/0313830 A1China Mobile Communications Group Co., Ltd.
- Channel geometry for targeted enhanced cooling in cold plates8 Oct 2026US 2026/0313831 A1Dell Products L. P.
- Regulating in-series thermal dissipation for enhanced system management8 Oct 2026US 2026/0313832 A1Dell Products L. P.
- System and method for providing supplemental power and cooling to one or more components of an electrical load8 Oct 2026US 2026/0313851 A1Toyota Jidosha Kabushiki Kaisha
- Cooling device for cooling electronic components8 Oct 2026US 2026/0313859 A1
Most cited
By later US patents
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Microcomponent chemical process sheet architecture299US 5,811,062 ABattelle Memorial Institute · 1998
- Microcomponent sheet architecture190US 5,611,214 ABattelle Memorial Institute · 1997
- Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink141US 6,349,035 B1Compaq Information Technologies Group, L.P. · 2002
- Heat sink for use in cooling an integrated circuit122US 6,400,012 B1Advanced Energy Voorhees, Inc. · 2002