Cooling device

A cooling device for dissipating heat from objects to be cooled, such as, for example, from power electronic modules, having a first hybrid cooling component through which cooling fluid can be guided and which has a heat sink of (optionally coated) metal or of a (optionally coated) metal alloy, which is connected in a fluid-tight manner to a base body of plastics material of the first hybrid cooling component and which is to be arranged on the objects to be cooled, and having a second hybrid cooling component which is connected to the first hybrid cooling component and through which the cooling fluid can be guided, and which has a plurality of cooling component portions, which are connected together (in pairs) in an articulated manner and each have a heat sink of (optionally coated) metal or of a (optionally coated) metal alloy which is to be arranged on the objects to be cooled and which is connected in a fluid-tight manner to a base body of plastics material of the second hybrid cooling component, wherein the two hybrid cooling components are positioned at a distance from one another and are connected together with the formation of a holding space arranged between them for the objects to be cooled, wherein

• the cooling device has a clamping device for clamping the first hybrid cooling component to the second hybrid cooling component, so that the heat sinks of the hybrid cooling components are each able to apply pressure forces, effected by the clamping device, to objects to be cooled which can be arranged between them, and
• the clamping device comprises a spring component which is arranged on, and applies pressure forces in the direction of the first hybrid cooling component to, the face of each cooling component portion of the second hybrid cooling component that is situated opposite the face on which the heat sink of the cooling component portion is arranged, and wherein this spring component is clamped to the first hybrid cooling component.