H05K 5/0034
Having an overmolded housing covering the pcb
Official title: {having an overmolded housing covering the PCB}
H05K5/0034 (Having an overmolded housing covering the pcb) appears on 113 US grants and 130 published applications in this corpus.
Search patents in H05K- Granted patents
- 113
- Published applications
- 130
- Assignees
- 79
- Inventors
- 262
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 8 |
| 2007 | 1 | 1 |
| 2008 | 6 | 3 |
| 2009 | 6 | 6 |
| 2010 | 1 | 2 |
| 2011 | 2 | 2 |
| 2012 | 3 | 0 |
| 2013 | 0 | 4 |
| 2014 | 0 | 3 |
| 2015 | 3 | 11 |
| 2016 | 4 | 6 |
| 2017 | 8 | 4 |
| 2018 | 7 | 11 |
| 2019 | 14 | 16 |
| 2020 | 12 | 15 |
| 2021 | 11 | 10 |
| 2022 | 3 | 7 |
| 2023 | 4 | 8 |
| 2024 | 9 | 6 |
| 2025 | 5 | 1 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Production process of flexible printed circuit encapsulation structure and flexible printed circuit encapsulation structure21 Jul 2026US 12,690,145 B2Shenzhen Dancing Future Technology Ltd.
- Sealed electronic housing14 Jul 2026US 12,684,722 B2Continental Automotive Technologies GmbH
- Reticle pod having anti-collision gap structure14 Jul 2026US 12,685,077 B2Gudeng Precision Industrial Co., Ltd.
- Electronic device and method to produce electronic device27 Jan 2026US 12,538,438 B2Darwin Precisions Corporation
- Overmolded printed circuit board and connector with integrated stand-up mounting and ground connection2 Dec 2025US 12,490,388 B2Vitesco Technologies USA, LLC
- Sealed electronic housing8 Jan 2026US 2026/0013060 A1Continental Automotive Technologies GmbH
- Rigid-flexible pcb, power module including the pcb, and manufacturing method of the power module29 May 2025US 2025/0176113 A1STMicroelectronics International N. V.
- Vehicular camera assembly with metal and plastic portions26 Dec 2024US 2024/0427220 A1Magna Electronics Inc.
- Electronic device and method to produce electronic device21 Nov 2024US 2024/0389244 A1Darwin Precisions Corporation
- Integrated circuit packages including carriers with incorporated substrates and interfaces24 Oct 2024US 2024/0357744 A1Intel Corporation
Most cited
By later US patents
- Overmolded electronic module with underfilled surface-mount components204US 6,307,749 B1Delphi Technologies, Inc. · 2001
- Apparatus and method for shielding a circuit from electromagnetic interference177US 6,709,291 B1TRW Inc. · 2004
- Method of forming an overmolded electronic assembly35US 6,180,045 B2Delco Electronics Corporation · 2001
- Camera for vehicle vision system27US 10,142,532 B2Magna Electronics Inc. · 2018
- Electronics enclosure and method of fabricating an electronics enclosure26US 7,294,007 B1Delphi Technologies, Inc. · 2007