Production process of flexible printed circuit encapsulation structure and flexible printed circuit encapsulation structure

A production process of a flexible printed circuit encapsulation structure, wherein the flexible printed circuit encapsulation structure comprises a FPC board body, a FPC molding tape, an elastic support body, two connector assemblies and a soft rubber jacket;

• and the production process comprises:
• a FPC over molding step:
• processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC molding tape fit closely each other;
• a support body assembly step:
• assembling the two connector assemblies on two ends of the elastic support body respectively;
• a main body assembly step:
• assembling a combination obtained by the FPC over molding step and a combination obtained by the support body assembly step;
• and a soft rubber over molding step:
• performing over molding on an exterior of an overall structure obtained by assembling the FPC board body, the FPC molding tape, the elastic support body and two connector assemblies to form the soft rubber jacket, wherein each connector assembly comprises a functional shell body and an inner connector;
• the inner connector is embedded in the functional shell body;
• and the functional shell body and the inner connector are formed by processing with an encapsulation process.