Method of forming an overmolded electronic assembly

Abstract

An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).

Dependencies are inferred from the claim text.