US 12,538,438 B2 · Electronic device and method to produce electronic device

Abstract

An electronic device includes a substrate and a plastic layer. The substrate has a first surface and a second surface opposite to each other; at least one of the first surface and the second surface is provided with an electronic assembly and a conducting wire; the conducting wire is electrically connected to the electronic assembly; the substrate further has a plurality of perforated holes; and the perforated holes extend to the second surface from the first surface. The plastic layer covers the first surface and the second surface, and fills in the perforated holes. Therefore, the electronic assemblies and the conducting wires can be arranged on both surfaces of the substrate, and the electronic assemblies on the first surface and the second surface both are protected by the plastic layer. In addition, also provided is a method to produce the electronic device.

Claims13

Dependent claims

An electronic device, comprising:

a substrate, having a first surface and a second surface opposite to each other, wherein at least one of the first surface and the second surface is provided with at least one electronic assembly and at least one conducting wire, the at least one conducting wire is electrically connected to the at least one electronic assembly, and the substrate further has a plurality of perforated holes extending to the second surface from the first surface;
and
a plastic layer, covering the first surface and the second surface and filling in the perforated holes.

A method to produce an electronic device, the method comprising steps of:

providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface or/and the second surface comprises at least one electronic assembly and at least one conducting wire, the at least one conducting wire is electrically connected to the electronic assembly, and the substrate further comprises a plurality of perforated holes extending towards the second surface from the first surface;
arranging the substrate in a first mold group, wherein the second surface is in contact with an inner wall surface of the first mold group, and a first gap is formed between the first surface and the inner wall surface of the first mold group;
injecting plastic into the first gap to form a transition substrate;
mounting the transition substrate in a second mold group, wherein the first forming portion is in contact with an inner wall surface of the second mold group, and a second gap is formed between the second surface and the inner wall surface of the second mold group;
and
injecting the plastic into the second gap.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/393,747Filed 22 Dec 2023

Priority

TW 11211847018 May 2023

Published

US 2024/0389244 A121 Nov 2024

Granted

27 Jan 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 5/0034
Provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units: having an overmolded housing covering the PCB
H05K 1/189
Structurally associated with non-printed electric components: characterised by the use of flexible or folded printed circuits
H05K 3/284
Applying non-metallic protective coatings: for encapsulating mounted components
H05K 5/065
Hermetically-sealed casings: sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Electronic device and method to produce electronic device

Life of this patent

Electronic device and method to produce electronic device

Life of this patent

Abstract

Claims13