H05K 3/102
By bonding of conductive powder, i.e. metallic powder
Official title: {by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence)}
H05K3/102 (By bonding of conductive powder, i.e. metallic powder) appears on 241 US grants and 211 published applications in this corpus.
Search patents in H05K- Granted patents
- 241
- Published applications
- 211
- Assignees
- 173
- Inventors
- 618
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 8 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 9 | 0 |
| 1992 | 8 | 0 |
| 1993 | 2 | 0 |
| 1994 | 10 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 6 | 3 |
| 2002 | 5 | 13 |
| 2003 | 7 | 11 |
| 2004 | 12 | 20 |
| 2005 | 5 | 20 |
| 2006 | 8 | 11 |
| 2007 | 8 | 14 |
| 2008 | 6 | 10 |
| 2009 | 5 | 17 |
| 2010 | 9 | 16 |
| 2011 | 7 | 4 |
| 2012 | 10 | 8 |
| 2013 | 6 | 3 |
| 2014 | 2 | 4 |
| 2015 | 2 | 5 |
| 2016 | 6 | 3 |
| 2017 | 3 | 5 |
| 2018 | 6 | 7 |
| 2019 | 5 | 12 |
| 2020 | 6 | 7 |
| 2021 | 4 | 7 |
| 2022 | 2 | 3 |
| 2023 | 5 | 4 |
| 2024 | 2 | 3 |
| 2025 | 0 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electronic component17 Feb 2026US 12,557,212 B2Murata Manufacturing Co., Ltd.
- Power delivery structures10 Sep 2024US 12,087,682 B2Intel Corporation
- System and method for controlling powder bed density for 3D printing4 Jun 2024US 11,998,982 B2Desktop Metal, Inc.
- System, apparatus, and method for producing printed electrically conductive lines24 Oct 2023US 11,799,183 B2Xerox Corporation
- Manufacturing of electric circuits on insulating coatings22 Jan 2026US 2026/0025929 A1Oerlikon Am Europe GmbH
- Process for producing an interconnect device for electronic and/or mechatronic components and interconnect device28 Nov 2024US 2024/0397630 A1
- Power delivery structures24 Oct 2024US 2024/0355725 A1Intel Corporation
- Electronic component1 Feb 2024US 2024/0040695 A1Murata Manufacturing Co., Ltd.
- Lift Printing of Fine Metal Lines28 Dec 2023US 2023/0422402 A1
Most cited
By later US patents
- Three-dimensional printing techniques1,084US 5,204,055 AMassachusetts Institute of Technology · 1993
- Three-dimensional printing techniques723US 5,387,380 AMassachusetts Institute of Technology · 1995
- Method of forming an electronic device387US 6,503,831 B2Patterning Technologies Limited · 2003
- Three-dimensional printing techniques380US 5,340,656 AMassachusetts Institute of Technology · 1994
- Three dimensional printing system272US 5,807,437 AMassachusetts Institute of Technology · 1998