Power delivery structures

An electronic system, comprising:

• an electronic board having a first surface;
• an integrated circuit assembly comprising:
• an electronic substrate having a first surface and an opposing second surface and at least one side extending between the first surface and the second surface of the electronic substrate;
• and
• an integrated circuit device having a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface;
• wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate, wherein the second surface of the electronic substrate of the integrated circuit assembly is electrically attached to the first surface of the electronic board, and wherein the integrated circuit device comprises at least one through-substrate via extending into the integrated circuit device from the second surface thereof;
• and
• at least one power delivery route electrically attached to the second surface of the integrated circuit device and electrically attached to the first surface of the electronic board, wherein the at least one power delivery route is conformal to at least a portion of the at least one side of the integrated circuit device, at least a portion of the first surface of the electronic substrate, at least a portion of the at least one side of the electronic substrate, and at least a portion of the first surface of the electronic board, and wherein the at least one power delivery route is electrically attached to the at least one through-substrate via.

An integrated circuit assembly, comprising:

• an electronic substrate having a first surface;
• an integrated circuit device having a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface, wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate;
• and
• at least one power delivery route electrically attached to the second surface of the integrated circuit device and the first surface of the electronic substrate, wherein the at least one power delivery route is conformal to at least a portion of the at least one side of the integrated circuit device and conformal to at least a portion of the first surface of the electronic substrate, and wherein the at least one power delivery route is non-linear on the second surface of the integrated circuit device.

An integrated circuit assembly, comprising:

• an electronic substrate having a first surface;
• an integrated circuit device having a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface, wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate;
• at least one power delivery route electrically attached to the second surface of the integrated circuit device and the first surface of the electronic substrate, wherein the at least one power delivery route is conformal to at least a portion of the at least one side of the integrated circuit device and conformal to at least a portion of the first surface of the electronic substrate;
• and
• at least one stacked power delivery route in a stacked configuration with and electrically attached to the at least one power delivery route on the second surface of the integrated circuit device.