H05K 2203/1327
Moulding over pcb locally or completely
Official title: Moulding over PCB locally or completely
H05K2203/1327 (Moulding over pcb locally or completely) appears on 440 US grants and 467 published applications in this corpus.
Search patents in H05K- Granted patents
- 440
- Published applications
- 467
- Assignees
- 311
- Inventors
- 1,115
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 9 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 0 |
| 2002 | 5 | 6 |
| 2003 | 2 | 3 |
| 2004 | 5 | 2 |
| 2005 | 4 | 4 |
| 2006 | 1 | 0 |
| 2007 | 4 | 5 |
| 2008 | 1 | 8 |
| 2009 | 3 | 4 |
| 2010 | 1 | 5 |
| 2011 | 4 | 6 |
| 2012 | 2 | 7 |
| 2013 | 8 | 11 |
| 2014 | 5 | 22 |
| 2015 | 11 | 23 |
| 2016 | 20 | 21 |
| 2017 | 23 | 42 |
| 2018 | 32 | 49 |
| 2019 | 40 | 42 |
| 2020 | 49 | 59 |
| 2021 | 48 | 40 |
| 2022 | 44 | 31 |
| 2023 | 25 | 29 |
| 2024 | 27 | 17 |
| 2025 | 18 | 18 |
| 2026 | 10 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Terminal block assembly, substrate and method of manufacture thereof9 Jun 2026US 12,651,854 B2Black & Decker Inc.
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Method of manufacturing a formed film14 Apr 2026US 12,604,397 B2Canatu Oy
- Self-healable, recyclable, and reconfigurable wearable electronics device14 Apr 2026US 12,604,398 B2The Regents of the University of Colorado, a body corporate
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Sensing device23 Jul 2026US 2026/0207053 A1Advanced Semiconductor Engineering, Inc.
- Molding compound application in printed circuit board by three dimensional (3d) stacking2 Jul 2026US 2026/0190232 A1Google Inc.
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Method of forming an electrical contact96US 8,966,747 B2VLT, Inc. · 2015
- Method of manufacturing multilayer circuit substrate73US 5,746,868 AFujitsu Limited · 1998