H05K 2203/1311
Foil encapsulation
Official title: Foil encapsulation, e.g. of mounted components
H05K2203/1311 (Foil encapsulation) appears on 115 US grants and 111 published applications in this corpus.
Search patents in H05K- Granted patents
- 115
- Published applications
- 111
- Assignees
- 119
- Inventors
- 326
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 5 |
| 2006 | 2 | 9 |
| 2007 | 2 | 10 |
| 2008 | 3 | 9 |
| 2009 | 7 | 9 |
| 2010 | 7 | 5 |
| 2011 | 5 | 3 |
| 2012 | 6 | 0 |
| 2013 | 1 | 5 |
| 2014 | 3 | 4 |
| 2015 | 3 | 3 |
| 2016 | 1 | 3 |
| 2017 | 2 | 5 |
| 2018 | 4 | 8 |
| 2019 | 2 | 5 |
| 2020 | 8 | 5 |
| 2021 | 1 | 2 |
| 2022 | 5 | 7 |
| 2023 | 5 | 6 |
| 2024 | 3 | 1 |
| 2025 | 4 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Self-healable, recyclable, and reconfigurable wearable electronics device14 Apr 2026US 12,604,398 B2The Regents of the University of Colorado, a body corporate
- Module9 Dec 2025US 12,495,501 B2Murata Manufacturing Co., Ltd.
- Adhesive circuit patterning process2 Dec 2025US 12,490,387 B2Jabil Inc.
- Solderless or groundless electromagnetic shielding in electronic devices5 Aug 2025US 12,382,575 B2Intel Corporation
- Module20 May 2025US 12,309,913 B2Murata Manufacturing Co., Ltd.
- Adhesive circuit patterning process5 Feb 2026US 2026/0040460 A1Jabil Inc.
- Adhesive circuit patterning process5 Feb 2026US 2026/0040461 A1Jabil Inc.
- Electronically functional multilayer structure18 Dec 2025US 2025/0386633 A1Continental Automotive Technologies GmbH
- Motherboard assembly, motherboard module and assembling method thereof1 May 2025US 2025/0141133 A1Getac Technology Corporation
- Electronic device including shielding structure for reducing mounting volume of component12 Sep 2024US 2024/0306354 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Removable rigid support structure for circuit cards112US 5,009,311 A1991
- Method and PDT probe for minimizing CT and MRI image artifacts111US 5,827,186 ALight Sciences Limited Partnership · 1998
- Double-sided flexible electronic circuit module92US 4,567,543 AMotorola, Inc. · 1986
- Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same80US 4,735,847 ASony Corporation · 1988
- Shielding for flat modules78US 5,703,761 A1997