Adhesive circuit patterning process

A method for adhesive circuit patterning consisting of:

• printing a circuit pattern directly on a single thermal adhesive film to form a printed circuit on the single thermal adhesive film;
• curing the printed circuit to form a cured printed circuit on the single thermal adhesive film;
• attaching one or more surface mounted devices to the cured printed circuit to form an assembled printed circuit on the single thermal adhesive film;
• placing the assembled printed circuit on a stretchable substrate;
• and
• after the attaching and the placing, melting the single thermal adhesive film directly onto the stretchable substrate to reinforce joint bonds between the one or more surface mounted devices and the cured printed circuit and to connect the assembled printed circuit to the stretchable substrate by heating the single thermal adhesive film to a melting temperature.

A method for adhesive circuit patterning consisting of:

• drying a single thermal adhesive film to prevent shrinkage and drive out moisture,
• printing a circuit pattern directly on the single thermal adhesive film,
• placing one or more surface mounted devices on a cured printed circuit of the printed circuit pattern;
• after the placing of the one or more surface mounted devices on the cured printed circuit, curing the one or more surface mounted devices and the cured printed circuit together to form an assembled printed circuit;
• after the curing, placing the assembled printed circuit on a stretchable substrate;
• and
• after the placing of the assembled printed circuit on the stretchable substrate, melting the single thermal adhesive film directly onto the assembled printed circuit and the stretchable substrate to reinforce joint bonds of the assembled printed circuit and to attach the assembled printed circuit to the stretchable substrate.