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US 5,703,761 AGranted
Shielding for flat modules
AssigneeSiemens Aktiengesellschaft
InventorReinhold Heiss
Life of this patent
Estimating the term…
Abstract
For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive manner with a contact surface on the circuit board that surrounds the components.
Claims3
A shielding for flat modules formed of high-frequency components on a circuit board in information technology equipment, comprising:
- a surface extending only over a region of components to be shielded and which is connected in an electrically conductive manner with a contact surface on the circuit board, said shielding surface surrounding the components and conducting a shielding potential;
- and
- the shielding surface comprising a metal lamination of a deep-drawn plastic film, the plastic film laminated with the conductive material being welded with the contact surface of the circuit board that conducts the shielding potential.
A shielding for certain ones of a plurality of components on a circuit board, comprising:
- a shielding surface extending only over a region of said certain components to be shielded but not over others of said plurality of components not to be shielded, said shielding surface being electrically connected with a contact surface on the circuit board adjacent said certain components;
- said shielding surface surrounding only said certain components and in contact with said contact surface at the certain components;
- and
- the shielding surface comprising a metal lamination overlying a deep drawn plastic film which lies over and is spaced above the certain components.
1 more element
Dependencies are inferred from the claim text.