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US 12,309,913 B2Granted
Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Ryoichi Kita, Tadashi Nomura
Life of this patent
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Abstract
A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.
Claims19
A module comprising:
- a substrate having a first face;
- a plurality of components mounted on the first face;
- a resin film covering the plurality of components along contours of the plurality of components and also covering a part of the first face;
- and
- a shield film provided to overlap the resin film,
- wherein the first face is provided with a ground electrode,
- the resin film has an opening,
- the shield film is connected to the ground electrode via the opening,
- the shield film has a dot-shaped recess corresponding to the opening,
- the shield film is separated by a slit, and wherein the first face of the substrate is exposed to an outside of said module via said slit, and
- the slit is provided in a region where a two-layer structure comprising the resin film and the shield film covers the first face of the substrate directly.
8 more elements
Dependencies are inferred from the claim text.