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US 12,495,501 B2Granted
Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Takafumi Kusuyama
Life of this patent
Estimating the term…
Abstract
A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.
Claims19
A module comprising:
- a substrate having a first surface;
- a first component mounted on the first surface;
- a sheet-shaped resin film covering the first component along a shape of the first component and also covering a part of the first surface;
- and
- one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate,
- wherein each of the one or more wires has a first end and a second end, and each of the one or more wires is separated from the resin film on the side of the first end and is in contact with the resin film on the side of the second end.
3 more elements
A module comprising:
- a substrate having a first surface and a second surface that face opposite to each other;
- a first component mounted on the first surface;
- a second component mounted on the first surface;
- a third component mounted on the second surface;
- a resin film covering the first component along a shape of the first component and also covering a part of the first surface;
- one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate;
- a first sealing resin disposed to cover the first surface, the resin film, the one or more wires, and the second component;
- a second sealing resin disposed to cover the second surface and the third component;
- and
- a shield film provided to cover an upper surface and a side surface of the second sealing resin and a side surface of the substrate and to cover a side surface of the first sealing resin, wherein
- a ground electrode is provided on the first surface between the first component and the second component,
- each of the one or more wires has a first end and a second end,
- the first end is electrically connected to the ground electrode, and
- the second end is connected to the first surface or electrically connected to the shield film on the side surface of the first sealing resin.
11 more elements
Dependencies are inferred from the claim text.