H05K 2203/104
Using magnetic force
Official title: Using magnetic force, e.g. to align particles or for a temporary connection during processing
H05K2203/104 (Using magnetic force) appears on 190 US grants and 156 published applications in this corpus.
Search patents in H05K- Granted patents
- 190
- Published applications
- 156
- Assignees
- 127
- Inventors
- 420
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 1 |
| 2002 | 4 | 0 |
| 2003 | 6 | 7 |
| 2004 | 5 | 8 |
| 2005 | 5 | 3 |
| 2006 | 1 | 6 |
| 2007 | 1 | 3 |
| 2008 | 2 | 2 |
| 2009 | 4 | 10 |
| 2010 | 5 | 10 |
| 2011 | 4 | 12 |
| 2012 | 5 | 8 |
| 2013 | 9 | 6 |
| 2014 | 9 | 4 |
| 2015 | 5 | 9 |
| 2016 | 6 | 7 |
| 2017 | 9 | 8 |
| 2018 | 6 | 10 |
| 2019 | 6 | 7 |
| 2020 | 8 | 10 |
| 2021 | 6 | 7 |
| 2022 | 3 | 6 |
| 2023 | 9 | 4 |
| 2024 | 4 | 4 |
| 2025 | 5 | 1 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for creating interconnections between a substrate and electronic components3 Feb 2026US 12,543,270 B2
- Circuit board assembly and manufacturing method thereof6 Jan 2026US 12,520,436 B2Avary Holding (Shenzhen) Co., Limited.
- Electrical connection structure using magnetic attraction2 Dec 2025US 12,489,245 B2LG Energy Solution, Ltd.
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Flexible LED vehicle-mounted display screen and production process thereof30 Sep 2025US 12,432,862 B1Shenzhen Juntong Technology Co., Ltd.
- Circuit board and manufacturing method thereof28 May 2026US 2026/0150197 A1Avary Holding (Shenzhen) Co., Limited.
- Systems, components and mechanisms to support electrical signal transmission in low temperature environments19 Mar 2026US 2026/0079201 A1Microsoft Technology Licensing, LLC
- Magnetic electronic component and hand-made circuit kit5 Mar 2026US 2026/0068053 A1Aidmics Biotechnology Co., Ltd.
- Circuit board assembly and manufacturing method thereof1 May 2025US 2025/0142737 A1Avary Holding (Shenzhen) Co., Limited.
- Method for Producing a Solder Connection and Assembly with a Solder Connection19 Dec 2024US 2024/0416443 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer116US 4,548,862 AMinnesota Mining and Manufacturing Company · 1985
- Anisotropically conductive composite medium93US 4,737,112 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1988
- Electrodynamic pump for dispensing molten solder84US 5,377,961 AInternational Business Machines Corporation · 1995
- Method of forming a monolayer of particles, and products formed thereby76US 6,180,226 B2Loctite (R&D) Limited · 2001
- Electrical interconnection by a composite medium70US 5,045,249 AAT&T Bell Laboratories · 1991