Circuit board assembly and manufacturing method thereof

A manufacturing method of a circuit board assembly, comprising:

• providing a first circuit board, wherein the first circuit board comprises:
• a first substrate;
• a first circuit structure, connected to the first substrate;
• a first magnetic layer, connected to the first circuit structure and making the first circuit structure be arranged between the first magnetic layer and the first substrate, wherein the first magnetic layer is not electrically connected to the first circuit structure;
• and
• a connecting pillar, connected to the first circuit structure, wherein the connecting pillar extends in a direction from the first circuit structure toward the first magnetic layer and through the first magnetic layer, and the connecting pillar is electrically connected to the first circuit structure;
• providing a second circuit board, comprising:
• a second circuit structure;
• a second magnetic layer, disposed on the second circuit structure;
• and
• at least one assembling hole, forming at the second magnetic layer and making the second circuit structure be partially exposed in the assembling hole;
• and
• using an attracting magnetic force generated between the first magnetic layer and the second magnetic layer to assemble the second circuit board and the first circuit board, wherein the connecting pillar is inserted into the assembling hole, and the connecting pillar electrically connected to the second circuit structure.