Circuit board and manufacturing method thereof
AssigneesAvary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Garuda Technology Co., Ltd.
InventorsYuan-Yu LIN, Jia-Hui WANG
Life of this patent
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Abstract
A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductive element. A first annular groove of the first circuit base board has a first internal extension groove. A second annular groove of the second circuit base board has a second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductive element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.
Claims16
A circuit board, comprising:
- a first circuit base board, comprising:
- a first interior region;
- a first annular groove surrounding the first interior region, wherein the first annular groove has a plurality of first internal extension grooves extending toward the first interior region;
- and
- at least one first conductive layer disposed on a bottom surface and a sidewall of at least one of the plurality of first internal extension grooves;
- a second circuit base board, comprising:
- a second interior region;
- a second annular groove surrounding the second interior region, wherein the second annular groove has a plurality of second internal extension grooves extending toward the second interior region;
- and
- at least one second conductive layer disposed on a bottom surface and a sidewall of at least one of the plurality of second internal extension grooves;
- an annular interposer disposed between the first circuit base board and the second circuit base board and located in the first annular groove and the second annular groove;
- and
- a conductive element disposed in one of the plurality of first internal extension grooves and one of the plurality of second internal extension grooves, wherein the conductive element electrically connects to the first conductive layer and the second conductive layer.
Dependencies are inferred from the claim text.