H05K 2203/0545
Pattern for applying drops or paste
Official title: Pattern for applying drops or paste; Applying a pattern made of drops or paste
H05K2203/0545 (Pattern for applying drops or paste) appears on 143 US grants and 131 published applications in this corpus.
Search patents in H05K- Granted patents
- 143
- Published applications
- 131
- Assignees
- 117
- Inventors
- 375
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 0 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 2 |
| 2002 | 10 | 12 |
| 2003 | 5 | 11 |
| 2004 | 10 | 10 |
| 2005 | 4 | 9 |
| 2006 | 7 | 6 |
| 2007 | 7 | 8 |
| 2008 | 5 | 9 |
| 2009 | 2 | 11 |
| 2010 | 7 | 7 |
| 2011 | 3 | 3 |
| 2012 | 7 | 3 |
| 2013 | 0 | 1 |
| 2014 | 2 | 6 |
| 2015 | 2 | 9 |
| 2016 | 3 | 7 |
| 2017 | 9 | 3 |
| 2018 | 3 | 4 |
| 2019 | 1 | 1 |
| 2020 | 0 | 2 |
| 2021 | 3 | 2 |
| 2022 | 1 | 1 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies3 Mar 2026US 12,564,908 B2Raytheon Company
- Barrier for preventing SMD components from drifting22 Oct 2024US 12,127,350 B2ZKW Group GmbH
- Method to electrically connect chip with top connectors using 3D printing23 Jul 2024US 12,046,575 B2IO Tech Group Ltd.
- Circuit formation method19 Dec 2023US 11,849,545 B2Fuji Corporation
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module1 Aug 2024US 2024/0260168 A1Vitesco Technologies GmbH
- Barrier for Preventing SMT Components from Drifting11 May 2023US 2023/0144136 A1ZKW Group GmbH
- Electronic component and method for manufacturing electronic component13 Apr 2023US 2023/0113966 A1Murata Manufacturing Co., Ltd.
- Circuit formation method3 Feb 2022US 2022/0039263 A1Fuji Corporation
Most cited
By later US patents
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Annular circuit components coupled with printed circuit board through-hole115US 5,708,569 AZycon Corporation · 1998
- Annular resistor coupled with printed circuit board through-hole105US 5,347,258 AZycon Corporation · 1994
- Printed circuit boards with integrated passive components and method for making same99US 6,021,050 ABourns, Inc. · 2000
- Screen printing plate and screen printing apparatus95US 8,141,484 B2Shin-Etsu Chemical Co., Ltd. · 2012