Barrier for preventing SMD components from drifting

A method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, comprising the following steps:

• a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a) that is coated with soldering paste (3) and designed for electrically, thermally and/or mechanically contacting the SMD component (1) to be connected, wherein a number of filled vias (6), which cannot be coated with molten soldering material, extend through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a);
• b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) in such a way that this adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) at an edge point (Ra, Rb) assigned to at least one side of the soldering paste (3);
• c) placing an SMD component (1) comprising at least one component contact surface (1a) on the printed circuit board contact surface (2a) coated with soldering paste (3) in such a way that the at least one component contact surface (1a) electrically, thermally and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, wherein said placement is carried out in such a way and the position of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) in step b) is chosen in such a way that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e);
• d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete;
• and
• e) heating, melting and subsequently cooling the soldering paste (3) in order to produce an electrical, thermal and/or mechanical connection between the at least one component contact surface (la) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2), wherein a barrier (5) is formed with the aid of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) in such a way that, first, the SMD component is allowed to vertically sink in the molten state of the soldering paste (3) and, second, the SMD component is mechanically restricted from horizontally drifting off in the direction of the barrier (5) on the molten soldering paste (3) by means of the barrier (5),
• wherein the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is applied by means of a dispenser and the SMD component (1) is placed by means of an automatic placement machine, wherein the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is in step b) positioned in such a way that it has at least a safety clearance(s) from the edge region of the nominal position of the SMD component (1), and wherein this safety clearance(s) is formed of the sum of the positioning tolerances of the dispenser and the automatic placement machine, the size tolerance of the at least one adhesive point (4a, 4b, 4c, 4d, 4e), as well as the component tolerance of the SMD component (1), and amounts to at least 50 micrometer.