Circuit formation method

A circuit formation method comprising:

• a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid;
• a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing metal particles onto the base so that the metal-containing liquid becomes conductive;
• a paste application step of applying a resin paste, containing metal particles different from the metal-containing liquid, on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other;
• and
• a component placement step of placing a component having an electrode onto the base, such that the electrode is in contact with the resin paste applied on the protruding portion,
• wherein, in the wiring formation step, the wiring connected to the protruding portion is formed by applying the metal-containing liquid onto the base until the metal-containing liquid reaches the protruding portion and firing the metal-containing liquid.

A circuit formation method comprising:

• a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid;
• a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing metal particles onto the base so that the metal-containing liquid becomes conductive;
• a paste application step of applying a resin paste, containing metal particles different from the metal-containing liquid, on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other;
• and
• a component placement step of placing a component having an electrode onto the base, such that the electrode is in contact with the resin paste applied on the protruding portion,
• wherein, in the wiring formation step, the wiring extending toward the protruding portion in a state of not being connected to the protruding portion is formed by applying the metal-containing liquid onto the base, such that the metal-containing liquid approaches the protruding portion and firing the metal-containing liquid.