H05K 2203/0528
Patterning during transfer, i.e. without preformed pattern
Official title: Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
H05K2203/0528 (Patterning during transfer, i.e. without preformed pattern) appears on 111 US grants and 113 published applications in this corpus.
Search patents in H05K- Granted patents
- 111
- Published applications
- 113
- Assignees
- 92
- Inventors
- 307
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 1 | 5 |
| 2006 | 5 | 8 |
| 2007 | 2 | 8 |
| 2008 | 4 | 11 |
| 2009 | 3 | 14 |
| 2010 | 10 | 9 |
| 2011 | 6 | 2 |
| 2012 | 1 | 2 |
| 2013 | 2 | 2 |
| 2014 | 3 | 1 |
| 2015 | 4 | 5 |
| 2016 | 1 | 1 |
| 2017 | 1 | 3 |
| 2018 | 2 | 5 |
| 2019 | 5 | 3 |
| 2020 | 4 | 6 |
| 2021 | 3 | 5 |
| 2022 | 4 | 3 |
| 2023 | 3 | 6 |
| 2024 | 4 | 5 |
| 2025 | 4 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package substrate including core with trench vias and planes5 May 2026US 12,621,937 B2Intel Corporation
- Large area laser printing system and method17 Feb 2026US 12,552,179 B2Reophotonics, Ltd.
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Transferring viscous materials9 Sep 2025US 12,414,241 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Controlled deposition method of a donor material onto a target surface and plate therefor29 Jul 2025US 12,376,237 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
- Manufacturing of electric circuits on insulating coatings22 Jan 2026US 2026/0025929 A1Oerlikon Am Europe GmbH
- Device and method for manufacturing printed circuit boards for electrical and/or electronic circuits13 Feb 2025US 2025/0056731 A1
Most cited
By later US patents
- Propellant-containing thermal transfer donor elements115US 5,278,023 AMinnesota Mining and Manufacturing Company · 1994
- Circuit-like metallic foil sheet and the like and process for producing them112US 5,645,932 AKabushiki Kaisha Miyake · 1997
- Method and apparatus for the thin film deposition of materials with a high power pulsed laser72US 4,970,196 AThe Johns Hopkins University · 1990
- Process for making a Z-axis adhesive and establishing electrical interconnection therewith65US 5,685,939 AMinnesota Mining and Manufacturing Company · 1997
- Method of making a printed circuit board48US 4,465,538 A1984