US 5,685,939 A · Process for making a Z-axis adhesive and establishing electrical interconnection therewith

Abstract

A Z-axis adhesive is produced by dispersing electrically-conductive particles in an organic binder and then imagewise exposing the material to electromagnetic radiation, preferably from a laser or a flash lamp, under conditions sufficient to transfer the particles from the binder to a receptor in a patterned fashion such that the resulting adhesive is a Z-axis conductor in the patterned areas. The patterned adhesive can then be used to establish electrical interconnection between facing electrodes of a number of different structures including semiconductor chips and a flexible printed circuit board.

Claims30

Dependent claims

A process for establishing electrical interconnection between two electrode-containing materials using a patterned Z-axis adhesive comprising the steps of:

(a) providing a donor element comprising a substrate having coated thereon a layer comprising electrically-conductive particles dispersed in an organic binder;
(b) placing said donor element in intimate contact with an adhesive receptor;
(c) imagewise exposing said donor element to electromagnetic radiation under conditions sufficient to transfer said electrically-conductive particles from said donor element to said adhesive receptor in a patterned fashion to form the Z-axis adhesive;
and
(d) bonding together a first and a second electrode-containing material with the Z-axis adhesive.

2 more elements

Dependencies are inferred from the claim text.

Process for making a Z-axis adhesive and establishing electrical interconnection therewith

Life of this patent

Process for making a Z-axis adhesive and establishing electrical interconnection therewith

Life of this patent

Abstract

Claims30