H05K 2203/0514
Photodevelopable thick film
Official title: Photodevelopable thick film, e.g. conductive or insulating paste
H05K2203/0514 (Photodevelopable thick film) appears on 128 US grants and 143 published applications in this corpus.
Search patents in H05K- Granted patents
- 128
- Published applications
- 143
- Assignees
- 80
- Inventors
- 304
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 4 |
| 2002 | 2 | 9 |
| 2003 | 7 | 8 |
| 2004 | 9 | 13 |
| 2005 | 4 | 14 |
| 2006 | 13 | 8 |
| 2007 | 7 | 4 |
| 2008 | 3 | 7 |
| 2009 | 4 | 8 |
| 2010 | 4 | 1 |
| 2011 | 2 | 1 |
| 2012 | 3 | 3 |
| 2013 | 2 | 4 |
| 2014 | 3 | 11 |
| 2015 | 4 | 12 |
| 2016 | 5 | 10 |
| 2017 | 5 | 6 |
| 2018 | 7 | 4 |
| 2019 | 7 | 3 |
| 2020 | 2 | 4 |
| 2021 | 4 | 2 |
| 2022 | 4 | 3 |
| 2023 | 1 | 2 |
| 2024 | 2 | 0 |
| 2025 | 0 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a formed film14 Apr 2026US 12,604,397 B2Canatu Oy
- Circuit board and method for manufacturing the same13 Aug 2024US 12,063,750 B2Avary Holding (Shenzhen) Co., Limited.
- Method to electrically connect chip with top connectors using 3D printing23 Jul 2024US 12,046,575 B2IO Tech Group Ltd.
- Exposure system, circuit board, and method for making circuit board9 May 2023US 11,647,592 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board and method for manufacturing the same6 Dec 2022US 11,523,517 B2Avary Holding (Shenzhen) Co., Limited.
- 3d printed bridges for printed interconnects4 Dec 2025US 2025/0372904 A1
- Composition, method for connecting a carrier and an electronic component, and electronic device12 Jun 2025US 2025/0194313 A1ams-OSRAM International GmbH
- Circuit board and method for manufacturing the same16 Feb 2023US 2023/0047768 A1Avary Holding (Shenzhen) Co., Limited.
- Formed film and a manufacturing method thereof19 Jan 2023US 2023/0014968 A1Canatu Oy
- Exposure system, circuit board, and method for making circuit board29 Sep 2022US 2022/0312599 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Direct write with microelectronic circuit fabrication159US 5,132,248 AThe United States of America as represented by the United States Department of Energy · 1992
- Radiation patternable functional materials, methods of their use, and structures formed therefrom57US 7,294,449 B1Kovio, Inc. · 2007
- Method for patterning carbon nanotube coating and carbon nanotube wiring55US 6,988,925 B2Eikos, Inc. · 2006
- Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods36US 6,468,891 B2Micron Technology, Inc. · 2002
- Method of using conductive polymers to manufacture printed circuit boards34US 5,545,308 ALynntech, Inc. · 1996