Formed film and a manufacturing method thereof
AssigneeCanatu Oy
InventorsIlkka VARJOS, Sari TAMMINEN
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Abstract
It is an object to provide a formed film and a method for manufacturing a formed film. According to an embodiment, a method for manufacturing a formed film comprises providing a formable film having a conductive pattern on a first side of the formable film. The method may further comprise printing a deformation-preventing element onto the formable film and forming at least one section of the formable film at a forming temperature. A modulus of elasticity of the deformation-preventing element at the forming temperature may be greater than a modulus of elasticity of the formable film at the forming temperature. A method, a formed film, and an electronic device are provided.
Claims20
1-23. (canceled)
A method for manufacturing a formed film, comprising:
- providing a formable film having a conductive pattern on a first side of the formable film;
- printing a deformation-preventing element onto the formable film by printing a nanopowder ink onto the formable film and sintering the nanopowder, wherein the deformation-preventing element is printed onto a second side of the formable film opposing the first side of the formable film;
- and
- forming at least one section of the formable film at a forming temperature;
- wherein a modulus of elasticity of the deformation-preventing element at the forming temperature is greater than a modulus of elasticity of the formable film at the forming temperature.
An electronic device, comprising:
- a formable film having a conductive pattern on a first side of the formable film;
- and
- a printed deformation-preventing element on the formable film manufactured by printing a nanopowder ink onto the formable film and sintering the nanopowder, wherein the deformation-preventing element is positioned on a second side of the formable film opposing the first side of the formable film;
- wherein a modulus of elasticity of the deformation-preventing element at a forming temperature is greater than a modulus of elasticity of the formable film at the forming temperature.
Dependencies are inferred from the claim text.