Exposure system, circuit board, and method for making circuit board
AssigneesQing Ding Precision Electronics (Huaian) Co., Ltd, Avary Holding (Shenzhen) Co., Limited.
InventorsChing-Lung Chuang, I-Hsin Chen, Li-Jen Chang
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Abstract
A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.
Claims9
A method for making a circuit board, comprising:
- providing a circuit substrate, wherein the circuit substrate comprises a base layer and a circuit layer on a surface of the base layer, and the base layer is electrically insulating;
- covering a surface of the circuit layer away from the base layer with dry film ink;
- and
- patterning the dry film ink to form a solder mask layer, wherein the solder mask layer defines a slot exposing a portion of the circuit layer, an exposed portion of the circuit layer forms a solder pad, the solder mask layer comprises a sidewall at the slot, and a cross section of the side wall along a thickness direction of the solder mask layer is a convex arc in shape facing the slot;
- wherein the dry film ink is patterned by irradiating the dry film ink with light of at least four different wavelengths in a range of 365 nm to 440 nm in an order from long wavelength to short wavelength, and the light of at least four different wavelengths comprises light of a wavelength in a range of 425 nm to 440 nm.
Dependencies are inferred from the claim text.