Circuit board and method for manufacturing the same
AssigneesAvary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co., Ltd
InventorsYING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
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Abstract
A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
Claims10
A circuit board, comprising:
- a base layer;
- and
- two first wiring layers disposed on two opposite surfaces of the base layer, each of the two first wiring layers comprising:
- a first bottom wiring formed on the base layer, the first bottom wiring comprising a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end;
- and
- a first electroplated copper wiring covering the second end and the first sidewall of the first bottom wiring.
Dependencies are inferred from the claim text.