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US 2025/0194313 A1Published application
Composition, method for connecting a carrier and an electronic component, and electronic device
Assigneeams-OSRAM International GmbH
InventorThomas Schwarz
Life of this patent
Estimating the term…
Abstract
In an embodiment a composition includes a solder material, a photoresist and a flux, wherein the solder material is present in form of particles, wherein at least a part of the particles have a different diameter, and wherein the diameter differs by at least one power of ten.
Claims18
-18. (canceled)
A composition comprising:
- a solder material;
- a photoresist;
- and
- a flux,
- wherein the solder material is present in form of particles,
- wherein at least a part of the particles have a different diameter, and
- wherein the diameter differs by at least one power of ten.
4 more elements
A method for connecting a carrier and an electronic component, the method comprising:
- providing the carrier with a connection point;
- applying a composition comprising a solder material and a photoresist, wherein a photostructurable layer is formed on the carrier;
- photostructuring the photostructurable layer;
- providing the electronic component;
- creating a solder connection between the electronic component and the connection point, wherein the solder connection is formed with a part of the solder material;
- after photostructuring the photostructurable layer, applying a tacky flux to the photostructurable layer;
- and
- removing the photoresist before creating the solder connection.
5 more elements
Dependencies are inferred from the claim text.