H05K 2201/2036
Permanent spacer or stand-off in a printed circuit or printed circuit assembly
H05K2201/2036 (Permanent spacer or stand-off in a printed circuit or printed circuit assembly) appears on 798 US grants and 817 published applications in this corpus.
Search patents in H05K- Granted patents
- 798
- Published applications
- 817
- Assignees
- 469
- Inventors
- 2,136
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 12 | 0 |
| 1990 | 9 | 0 |
| 1991 | 12 | 0 |
| 1992 | 11 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 10 | 0 |
| 1999 | 14 | 0 |
| 2000 | 16 | 0 |
| 2001 | 20 | 13 |
| 2002 | 26 | 43 |
| 2003 | 32 | 40 |
| 2004 | 29 | 44 |
| 2005 | 33 | 47 |
| 2006 | 27 | 44 |
| 2007 | 38 | 39 |
| 2008 | 28 | 56 |
| 2009 | 25 | 39 |
| 2010 | 28 | 32 |
| 2011 | 28 | 30 |
| 2012 | 33 | 19 |
| 2013 | 21 | 20 |
| 2014 | 9 | 42 |
| 2015 | 22 | 30 |
| 2016 | 23 | 19 |
| 2017 | 23 | 22 |
| 2018 | 24 | 25 |
| 2019 | 25 | 23 |
| 2020 | 24 | 34 |
| 2021 | 28 | 37 |
| 2022 | 31 | 26 |
| 2023 | 21 | 36 |
| 2024 | 23 | 24 |
| 2025 | 24 | 19 |
| 2026 | 9 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device15 Sep 2026US 12,739,984 B2Samsung Display Co., Ltd.
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Standoff for circuit card assemblies28 Jul 2026US 12,696,411 B2Hamilton Sundstrand Corporation
- Vacuum-based attachment for heat sink and radiation shield9 Jun 2026US 12,652,786 B2Intel Corporation
- Dimple on circuit board for providing standoff between circuit board and circuit package12 May 2026US 12,628,270 B2Dell Products L. P.
- Easy to remove standoff20 Aug 2026US 2026/0247537 A1Quanta Computer Inc.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Sensor arrangement with integrated electronics2 Jul 2026US 2026/0185857 A1Volkswagen Aktiengesellschaft
- Fixing device and electronic equipment18 Jun 2026US 2026/0173270 A1Fulian Precision Electronics (Tianjin) Co., LTD.
- Camera module4 Jun 2026US 2026/0156340 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Rearview mirror element having a circuit mounted to the rear surface of the element219US 7,706,046 B2Gentex Corporation · 2010
- Pad array carrier IC device using flexible tape207US 5,045,921 AMotorola, Inc. · 1991